Lateral-disturbance injection and preparation device for uniform micron-sized tin alloy balls
A preparation device and tin alloy technology, which are applied in the field of micron-level uniform tin alloy ball lateral disturbance spray preparation device, can solve the problem that uniform micron-level tin alloy droplets cannot be continuously sprayed, and achieve the effect of avoiding the entry of impurities
Inactive Publication Date: 2019-08-13
NORTHWESTERN POLYTECHNICAL UNIV
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Problems solved by technology
[0004] In order to overcome the deficiency that the existing spraying preparation device cannot continuously spray uniform micron-sized tin alloy droplets, the present invention provides a lateral disturbance spraying preparation device for micron-sized uniform tin alloy balls
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[0012] The following examples refer to figure 1 .
[0013] The micron-level uniform tin alloy ball lateral disturbance injection preparation device of the present invention includes a nitrogen bottle 1, a pressure controller 2, a gas protection environment 3, a crucible 4, a heating furnace 5, a filter screen 6, a nozzle assembly 7, an excitation system 8, and a nozzle 9. Collection device 10 , temperature controller 11 , piezoelectric transducer driver 12 and vacuum pump 13 . The crucible 4 is located in the heating furnace 5, the filter screen 6 is placed between the crucible 4 and the nozzle assembly 7, the nozzle assembly 7 is mechanically connected with the excitation system 8, the crucible 4, the heating furnace 5, the filter screen 6, the nozzle assembly 7, the excitation system The vibration system 8, the nozzle 9 and the collection device 10 are placed in the gas protection environment 3, the nitrogen cylinder 1 is connected to the crucible 4 through the pressure con...
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The invention discloses a lateral-disturbance injection and preparation device for uniform micron-sized tin alloy balls. The lateral-disturbance injection and preparation device for the uniform micron-sized tin alloy balls is used for solving the technical problem that an existing injection and preparation device is incapable of continuously injecting uniform micron-sized tin alloy microdroplets.The technical scheme is as follows: the lateral-disturbance injection and preparation device for the uniform micron-sized tin alloy balls comprises a nitrogen cylinder, a pressure controller, a gas protection environment, a crucible, a heating furnace, a filter screen, a nozzle assembly, a vibration system, a nozzle, a collection device, a temperature controller, a piezoelectric transducer driverand a vacuum pump. A nozzle connection assembly is arranged on the lower part of the crucible, the micron-sized filter screen is loaded on the upper part of the connection assembly, and pollutant isolation is realized, so that filtered molten tin alloy is obtained; and the side surface of the nozzle assembly is connected with the vibration system, the nozzle assembly transfers the vibration generated by the vibration system to the filtered molten tin alloy, and cleaning can be carried out without the need of opening the crucible, so that the entrance of impurities is avoided. Meanwhile, due tothe design of lateral vibration, the high-temperature crucible is isolated from the vibration system, so that piezoelectric ceramic is protected from high-temperature influence, and the purpose of continuously injecting the uniform micron-sized tin alloy microdroplets is achieved.
Description
technical field [0001] The invention relates to a spray preparation device, in particular to a micron-level uniform tin alloy ball lateral disturbance spray preparation device. Background technique [0002] At present, uniform tin alloy solder balls have more and more important applications in the electronics industry. For example, uniform tin alloy solder ball is the main component of solder paste, and its size, uniformity and sphericity directly determine the yield rate of soldered parts, printing resolution and other indicators. At present, the size of tin alloy solder balls in tin solder paste is mostly on the order of hundreds of microns. In order to further improve the quality and resolution of solder paste brazing joints, it is necessary to further reduce the size of tin alloy solder balls. On the other hand, the Ball Grid Array (BGA) package uses uniform tin alloy solder balls as the pins of the chip. The size of the solder balls directly determines the density of t...
Claims
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Patent Timeline
Login to View More IPC IPC(8): B22F9/08
CPCB22F9/082B22F2009/0808B22F2009/0824
Inventor 罗俊王子尧齐乐华苏林吕胜楠
Owner NORTHWESTERN POLYTECHNICAL UNIV