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Semiconductor Package Structure

A packaging structure and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of high price, heavy metal material, and difficult to shape, and achieve cost saving, light and thin Volume, the effect of avoiding malfunction or malfunction

Active Publication Date: 2021-02-19
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal conductors are good materials for preventing electromagnetic interference, but metal materials are heavy, difficult to shape, and expensive, and cannot meet the needs of small-sized, low-cost mass production, and are not conducive to the thinning of the package

Method used

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  • Semiconductor Package Structure
  • Semiconductor Package Structure
  • Semiconductor Package Structure

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Embodiment Construction

[0042] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0043] figure 1 A schematic side view of a semiconductor package structure according to an embodiment of the present invention is shown. Please refer to figure 1 A semiconductor packaging structure 100 of the present invention includes a circuit substrate 110 , a chip 120 , a first electromagnetic shielding layer 130 , a second electromagnetic shielding layer 140 and an encapsulant 160 . What must be explained here is that the present invention figure 1 For the sake of clarity of the components and clearly showing the positional relationship between the first electromagnetic shielding layer 130 and the second electromagnetic shielding layer 140 and other components, the first electromagn...

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Abstract

A semiconductor package structure includes a substrate, a chip, a first electromagnetic shielding, a second electromagnetic shielding, and an encapsulant. The substrate includes a plurality of first bonding pads. The chip is disposed one the substrate, including an active surface and a non-active surface opposite to each other, and a plurality of second bonding pads disposed on the active surface. The bonding pads are electrically connected to the first bonding pads. The first electromagnetic shielding is disposed on the active surface of the chip and an area outside of these second bonding pads. The first electromagnetic shielding is insulated from these second bonding pads. The second electromagnetic shielding is disposed on the non-active surface of the chip. The encapsulant encapsulates the substrate, the chip, the first electromagnetic shielding, and the second electromagnetic shielding.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a semiconductor packaging structure. Background technique [0002] As electronic products continue to develop toward small size, multi-function, and high-efficiency trends, integrated circuit chips must also meet the requirements of miniaturization, high density, high power, and high speed. Therefore, electronic signals are subject to electromagnetic interference (Electro-Magnetic Interference, EMI ) is getting worse. In order to avoid the problem of electromagnetic interference affecting the stability of the integrated circuit chip during use, a metal cover is traditionally covered outside the chip to prevent the leakage of electromagnetic waves or to prevent interference caused by external electromagnetic waves infiltrating. Metal conductors are good materials for preventing electromagnetic interference, but metal materials are heavy, difficult to shape, and expensive, and cannot meet ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552
CPCH01L23/552H01L2224/48227H01L2224/4824H01L2924/3025
Inventor 高靖尧
Owner CHIPMOS TECH INC