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Low-temperature co-fired ceramic dielectric material and preparation method thereof

A technology of low-temperature co-fired ceramics and dielectric materials, applied in the field of low-temperature co-fired ceramic dielectric materials and their preparation, can solve problems such as ignoring the application reliability of LTCC materials, achieve the effect of improving temperature stability and reducing dielectric loss

Active Publication Date: 2019-08-16
SHENZHEN SUNWAY COMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a long time, most research results have focused on improving the dielectric properties of LTCC materials, ignoring the application reliability of LTCC materials, especially the research on dielectric temperature stability.

Method used

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  • Low-temperature co-fired ceramic dielectric material and preparation method thereof
  • Low-temperature co-fired ceramic dielectric material and preparation method thereof
  • Low-temperature co-fired ceramic dielectric material and preparation method thereof

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preparation example Construction

[0020] A method for preparing a low-temperature co-fired ceramic dielectric material, comprising the steps of,

[0021] S1, the K 2 CO 3 、Al 2 o 3 、H 3 BO 3 and SiO 2 According to the molar ratio of 0.5:0.05:0.45:2, the mixed raw materials are mixed to obtain the mixed raw materials; the mixed raw materials are sequentially subjected to ball milling, drying, granulation, compression molding, sintering and crushing to obtain Al-K-B-Si glass ceramics Powder;

[0022] S2, Al 2 o 3 , CaCO 3 and the Al-K-B-Si glass-ceramic powder obtained in step S1 are uniformly mixed according to the mole fraction ratio of 1:x:0.5 to obtain a mixture, wherein the value range of x is greater than 0 and less than or equal to 1; the described The mixture is ball milled and dried after discharge to obtain the dried material;

[0023] S3, sequentially performing granulation, compression molding, debinding and sintering treatment on the dried material obtained in step S2 to obtain a finished...

Embodiment 1

[0035] Please refer to Figure 1 to Figure 3 , Embodiment 1 of the present invention is: according to 0.5K 2 O-0.05Al 2 o 3 -0.45B 2 o 3 -2SiO2 2 chemical formula, weigh the corresponding raw materials (K 2 CO 3 、Al 2 o 3 、H 3 BO 3 and SiO 2 ), using absolute ethanol as the ball milling medium, adding the weighed raw materials into the ball milling tank, using the planetary ball milling process to uniformly mix and ball mill for 4 hours; 3wt% binder granulation (in this embodiment, binder accounted for 2wt% of the powder mass), through dry pressing molding to obtain disc-shaped green body; green body is placed in the muffle furnace, under air atmosphere . Calcining at 800° C. for 4 hours, cooling with the furnace, grinding and sieving to obtain Al-K-B-Si glass-ceramic powder.

[0036] Al-K-B-Si glass ceramic powder and Al 2 o 3Mix evenly according to the mole fraction ratio of 0.5:1; use the planetary ball milling process to uniformly ball mill for 6 hours, dry ...

Embodiment 2

[0039] Please refer to Figure 1 to Figure 3 , the second embodiment of the present invention is: according to 0.5K 2 O-0.05Al 2 o 3 -0.45B 2 o 3 -2SiO2 2 chemical formula, weigh the corresponding raw materials (K 2 CO 3 、Al 2 o 3 、H 3 BO 3 and SiO 2 ), using absolute ethanol as the ball milling medium, adding the weighed raw materials into the ball milling tank, using the planetary ball milling process to uniformly mix and ball mill for 4 hours; 3wt% binder granulation (in this embodiment, binder accounted for 2wt% of the powder mass), through dry pressing molding to obtain disc-shaped green body; green body is placed in the muffle furnace, under air atmosphere . Calcining at 800° C. for 4 hours, cooling with the furnace, grinding and sieving to obtain Al-K-B-Si glass-ceramic powder.

[0040] Al-K-B-Si glass ceramic powder and Al 2 o 3 , CaCO 3 Mix evenly according to the mole fraction ratio of 0.5:1:0.1; use the planetary ball milling process to uniformly bal...

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Abstract

The invention discloses a low-temperature co-fired ceramic dielectric material and a preparation method thereof. The low-temperature co-fired ceramic dielectric material comprises Al2O3-0.5(0.5K2O-0.05Al2O3-0.45B2O3-2SiO2)-xCaCO3, wherein the value range of x is greater than 0 and less than or equal to 1. While maintaining low sintering temperature and excellent dielectric properties of LTCC materials, the change rate of dielectric constant with temperature is significantly reduced from 82.2% to 3.1% in the temperature range of 25-200 DEG C. The temperature stability of dielectric loss is alsogreatly improved.

Description

technical field [0001] The invention relates to the field of low-temperature co-fired ceramic packaging substrate materials, in particular to a low-temperature co-fired ceramic dielectric material and a preparation method thereof. Background technique [0002] Low temperature co-fired ceramics (LTCC) technology is a new type of multilayer substrate technology that emerged in the mid-1980s. This technology adopts a unique material system with low sintering temperature (usually lower than 900°C), which can be co-fired with metal conductors, which is helpful to improve the performance of electronic devices; at the same time, due to the unique multi-layer co-firing process, thus The complexity of the process is greatly reduced, and the reliability of the components is improved. [0003] In addition to the characteristics of low sintering temperature, LTCC materials also need to have low dielectric constant and low dielectric loss characteristics to meet the requirements of high...

Claims

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Application Information

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IPC IPC(8): C04B35/10C04B35/622C04B35/64C03C10/14
CPCC04B35/10C04B35/622C04B35/64C03C10/0009C04B2235/3201C04B2235/3418C04B2235/3409C04B2235/442
Inventor 宋喆虞成城苏聪刘飞华刘开煌王凤
Owner SHENZHEN SUNWAY COMM