A silicon wafer drying machine

Abstract

The invention discloses a silicon wafer spin-drying machine. The silicon wafer spin-drying machine comprises a centrifugal spin-drying component, a sealing cover and a machine frame, wherein the centrifugal spin-drying component comprises a spin-drying bucket, a centrifugal basket, a spin-drying box, a fixing frame and a centrifugal power component, the spin-drying barrel is provided with a cylindrical barrel wall, an adjusting hole of a lifting mechanism is formed in the periphery of the barrel wall, a dewatering pipe and a pressure relief pipe are arranged on the inner side of the barrel wall in a tangent mode, an inclined U-shaped frame hole is formed in the peripheral side wall of the centrifugal basket, the spin-drying box which is hung on the inclined U-shaped frame hole through a lifting rod, plate-shaped lifting blocks are arranged at the two ends of the lifting rod, and the fixing frame is fixedly connected with the spin-drying barrel; a rotary shaft connecting hole is formedin the center of the bottom end of the centrifugal basket, the rotary shaft connecting hole is fitted with the keyway of the centrifugal power component provided at the lower part, and the centrifugalpower component comprises a centrifugal rotating mechanism, a position adjusting mechanism and the lifting mechanism. According to the silicon wafer spin-drying machine, a to-be-spin-dried wafer boxis placed in the spin-drying box by utilizing the principle of centrifugal spin-drying dehydration, the centrifugal rotating mechanism is used for driving the spin-drying bucket to rotate at a high speed to dry the water into the dewatering pipe, the automation degree is high, and the silicon wafer spin-drying machine is practical and convenient.

Description

technical field [0001] The invention relates to the technical field of semiconductor silicon wafer processing, in particular to a silicon wafer drying machine. Background technique [0002] In the field of semiconductor chip production technology, the residue left on the surface of the silicon wafer during the production process is cleaned. The production process of silicon wafers includes plasma etching and chemical mechanical polishing. If residues and fine particles are left on the surface of silicon wafers during continuous manufacturing operations, these residues and particles can cause defects such as scratches on the silicon wafer surface and improper interactions between metallization features. In some cases, such defects may cause devices on silicon wafers to become inoperable, resulting in additional costs that must be properly and efficiently cleaned after manufacturing operations that leave unwanted residue on the silicon wafer surface Silicon wafer surface. ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method of spinning and dehydrating the silicon wafer to dry the silicon wafer in view of the problem that the cleaning effect of the surface of the silicon wafer is not good in the above-mentioned background technology.

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