Unlock instant, AI-driven research and patent intelligence for your innovation.

Surface conductive laminated sheet and packaging container for electronic components

A conductive and surface layer technology, which is applied in the field of surface conductive laminates and electronic component packaging containers, can solve problems such as poor pickup, difficulty in picking up electronic components, and deformation

Active Publication Date: 2021-04-09
DENKA CO LTD
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, with the miniaturization of electronic components, when the electronic components contained in the embossed part (also called pocket part) of the carrier tape are taken out and automatically mounted on the printed circuit board, the pick-up nozzle does not touch the carrier tape and the Accurate Picking of Electronic Components Becomes Extremely Difficult
If the pick-up nozzle comes into contact with the carrier tape, the carrier tape may be crushed or deformed, and the so-called pick-up failure caused by obstructing the pick-up route becomes a problem.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface conductive laminated sheet and packaging container for electronic components
  • Surface conductive laminated sheet and packaging container for electronic components
  • Surface conductive laminated sheet and packaging container for electronic components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] As the carbon black, granular acetylene black manufactured by Denka Co., Ltd. was used.

[0063] Ethylene-ethyl acrylate copolymer resin (hereinafter referred to as EEA) as an olefin-based resin, using ethyl acrylate content (measured in accordance with JIS-K-7192) = 18%, melt flow index (measured in accordance with JIS-K-7192) = 5.0 g / 10 minutes of resin. In addition, as the high-density polyethylene resin (hereinafter referred to as HDPE), a polyethylene resin having a melt flow index (measured according to JIS-K-6922-2) = 0.20 g / 10 minutes was used.

[0064] The melt flow index (based on JIS-K- 7192 assay) = 4.0 g / 10 minutes, a resin having a mass % ratio of styrene to butadiene of 60:40.

[0065] As shown in Table 2, polystyrene resin, high-impact polystyrene resin A, carbon black, EEA, HDPE, and SEBS were weighed in a ratio of 29:31:20:9:8:3, and used After mixing evenly with a high-speed mixer, use The vented twin-screw extruder was used for kneading and gran...

Embodiment 2～13、 comparative example 1～4

[0069] According to the method of the aforementioned Example 1, a surface conductive laminated sheet was obtained. Each raw material and their mixing ratio are shown in Table 2 and Table 3.

[0070] The evaluation results of the sheets produced in the respective Examples and Comparative Examples are summarized and shown in Tables 2 and 3.

[0071] Table 2

[0072]

[0073] table 3

[0074]

[0075] From the results shown in Table 2 and Table 3, the following conclusions can be drawn. It was confirmed that the surface conductive laminated sheets of the respective examples ensured practically sufficient tensile modulus, flexural strength, and surface resistivity as sheets for packaging various electronic components, and at the same time, the Martensitic The hardness is also high, and even if the pick-up nozzle contacts the carrier tape obtained by molding these sheets, the carrier tape will not be crushed or deformed. On the other hand, it has been confirmed that the s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
hardnessaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The present invention provides a surface conductive laminated sheet having excellent strength that suppresses crushing and deformation of the carrier tape even when a pick-up nozzle comes into contact with the carrier tape when electronic components are mounted, and provides an electronic component packaging container molded therefrom, Especially carrier tapes or trays for transporting electronic components. The present invention is a surface conductive laminated sheet, which has 50-130N / mm 2 Martens hardness of 2.0-7.4% by mass of polystyrene resin containing conjugated diene content of 2.0-7.4% by mass on both sides of the sheet base material layer composed of 3.0-8.2% by mass of conjugated diene. A surface layer composed of a conductive resin composition of a vinyl resin and a conductive filler.

Description

technical field [0001] The present invention relates to a surface conductive laminated sheet made of thermoplastic resin, and electronic component packaging containers such as carrier tapes and electronic component transport trays using the laminated sheet. Background technique [0002] Vacuum-formed trays and embossed carrier tapes obtained by heat-forming sheets are used in packaging containers for intermediate products of all industrial products such as electronic equipment and automobiles. Furthermore, sheets obtained by laminating polystyrene resins containing conductive fillers such as carbon black on a base layer made of polystyrene resins have been used as ICs easily damaged by static electricity and various electronic components having ICs. sheets for packaging containers (for example, refer to Patent Documents 1 to 3). [0003] In recent years, with the miniaturization of electronic components, when the electronic components contained in the embossed part (also ca...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/30B32B27/18B65D65/40B65D85/86
CPCB32B27/18B32B27/30B65D65/40B32B7/025B32B27/08B32B27/20B32B27/302B32B2264/108B32B2307/202B32B2553/00
Inventor 福田祐子升田优亮
Owner DENKA CO LTD