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An eight-inch infrared detector packaging window and its preparation method

A technology for infrared detectors and detector chips, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as high cost, inability to mass-produce, and complicated processes, so as to improve production efficiency and meet integration requirements. The effect of mass production and cost reduction

Active Publication Date: 2022-03-11
上海欧菲尔光电技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, the packaging window of infrared focal plane detectors mainly adopts the small-chip unit production process, which is high in cost and complicated in process, and cannot be mass-produced

Method used

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  • An eight-inch infrared detector packaging window and its preparation method
  • An eight-inch infrared detector packaging window and its preparation method
  • An eight-inch infrared detector packaging window and its preparation method

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Embodiment Construction

[0026] The specific embodiment of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0027] see figure 1 In the present invention, the packaging window of the eight-inch infrared detector includes: an eight-inch silicon wafer substrate 1 , a packaging window unit 2 and an alignment mark 7 .

[0028] The quantity and position of the packaging window units 2 correspond one-to-one to the quantity and position of the detector chips on another wafer. In the present invention, the packaging window of the eight-inch wafer and another wafer provided with the detector chip are two independent wafers, which can realize wafer-level packaging.

[0029] The alignment marks 7 are arranged on the first surface and the second surface of the wafer substrate 1 and are symmetrical in pairs. The alignment marks are located between the package window units 2 and are uniformly and symmetrically distributed on the wafer package windows, ...

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Abstract

The invention discloses a design and preparation method of an eight-inch optical packaging window. The wafer-level packaging window is mainly used for an uncooled infrared focal plane detector. A packaging window unit array is evenly distributed on the surface of the wafer. The array and another There is a one-to-one correspondence between the number and position of detector chips on a wafer. In the present invention, the wafer encapsulation window includes an eight-inch silicon wafer base, an encapsulation window unit, and an alignment mark; the encapsulation window unit includes an optical film plated on the first surface of the base, a metal encapsulation layer, a getter, and a metal encapsulation The solder layer on the layer and the optical film plated on the second surface of the substrate. The present invention also clarifies the preparation method of the above-mentioned wafer-level packaging window. The eight-inch wafer packaging window described in the present invention is engraved with an alignment mark, which can be packaged with an eight-inch detector chip wafer at the wafer level, and then the splits are cut by laser stealth. This production method is applicable to infrared detectors of mass production.

Description

technical field [0001] The invention relates to the technical field of infrared focal plane detector production, in particular to an eight-inch infrared detector package window based on single crystal silicon and a preparation method thereof. Background technique [0002] Infrared thermal imaging equipment is a high-tech product used to detect the infrared radiation of the target object, and convert the temperature distribution image of the target object into a video image through photoelectric conversion, electrical signal processing and other means. It has high military application value and civilian value. In the military, it can be used in military night reconnaissance, weapon sights, night vision guidance, infrared search and tracking, satellite remote sensing and other fields. In terms of civil use, it can be used in many fields such as security monitoring, building energy-saving detection, thermal diagnosis of equipment status, production process monitoring, automobi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67011H01L21/67121H01L21/682
Inventor 赵中亮
Owner 上海欧菲尔光电技术有限公司