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Colorless polyimide, and preparation method and application thereof

A technology of polyimide and products, which is applied in the application of substrates and resin products, and in the field of thin films, which can solve the problems of not being able to meet the requirements of device processing technology and the increase of thermal expansion coefficient

Active Publication Date: 2019-08-23
SHANGHAI INST OF ORGANIC CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, at high temperature, these polyimide films will soften, and the coefficient of thermal expansion will increase sharply, which cannot meet the requirements of some device processing techniques

Method used

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  • Colorless polyimide, and preparation method and application thereof
  • Colorless polyimide, and preparation method and application thereof
  • Colorless polyimide, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0082] Its preparation method includes the following steps: dissolving the polyimide shown in formula II in N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl base sulfoxide, cyclohexanone, or a combination thereof; pour the solution onto a clean and flat glass plate, scrape and coat it to form a film, let it evaporate and dry naturally, and then heat it under vacuum at 100-140°C for 10-30min to remove Remove the remaining solvent into a polyimide film.

[0083] The positive progress effect of the present invention is:

[0084] (1) The thermal stability of polyimide film prepared by the present invention is good, has high transparency simultaneously (light transmittance exceeds 75% under visible light 400nm-800nm ​​wavelength range) glass transition temperature (> 360 ℃), low The coefficient of thermal expansion (<30ppm / °C) can meet the processing and application requirements of flexible substrate materials, provide key material support for the develo...

Embodiment 1

[0089] The preparation of embodiment 1 compound A

[0090]

[0091] Anethole (5g, 33.7mmol) and 4-maleimide phenol (14.0g, 74.2 mmol), 0.2mL N,N-dimethylaniline and 30mL ethyl acetate were added successively to 150mL sealed tube middle. Seal the tube, heat up to 140°C and react for 12 hours, then carry out column chromatography separation, ethyl acetate:petroleum ether (v:v=3:1) as the eluent, collect the product, and obtain 8.2g of white solid compound A, the product The rate is 44.2%.

[0092] 1 H NMR (400MHz, d 6 -DMSO,ppm)δ9.75(s,1H),9.67(s,1H),6.88~6.76(m,8H),5.63(d,J=31.5Hz,1H),4.94(dd,J=7.0, 2.0Hz, 1H), 3.59(dd, J=6.9, 2.9Hz, 1H), 3.38(m, 2H), 3.35(dd, J=7.9, 3.3Hz, 2H), 3.22(d, J=12.5Hz, 3H), 3.04(m 1H), 2.56(d, J=8.8Hz, 1H), 2.35(s, 1H), 1.45(d, J=7.3Hz, 3H).

[0093] 13 C NMR (101MHz, d 6 -DMSO, ppm) δ177.3, 177.1, 176.4, 174.9, 158.6, 157.3, 157.1, 140.6, 128.3, 127.9, 123.6, 123.3, 122.8, 115.5, 115.3, 92.9, 54.2, 45.8, 45.6, 43.1, 98.0 .

[0094] HRMS...

Embodiment 2

[0096] The preparation of embodiment 2 compound B

[0097]

[0098] Add compound A (0.4g, 0.7mmol), 50mL ethanol, 3mL concentrated hydrochloric acid to a 100ml single-necked bottle, stir at room temperature for 12h, NaHCO 3 The aqueous solution was neutralized to neutral, the solvent was removed by rotary evaporation, the product was washed with deionized water (20 mL×3), and dried in vacuo to obtain 0.3 g of compound B as a white solid, with a yield of 85.0%.

[0099] 1 H NMR (400MHz, d 6 -DMSO,ppm):δ9.78(s,1H),9.73(s,1H),6.94~6.78(m,8H),5.79(s,1H),3.51~3.47(m,2H),3.31~3.28 (m,1H),3.23~3.20(m,3H),2.95(m,1H),2.53(m,1H),2.19(d,J=5.6Hz,1H),1.88(d,J=18.8Hz, 1H), 1.42(d, J=7.3Hz, 3H).

[0100] 13 C NMR (101MHz, d 6 -DMSO, ppm): δ206.8, 176.8, 176.5, 176.5, 175.6, 157.5, 157.3, 139.4, 128.1, 128.0, 125.8, 123.1, 123.0, 115.5, 115.4, 48.3, 45.9, 45.1, 43.2, 12.6, 4.0, 4 38.9, 38.0, 36.1, 30.7, 30.1, 17.1.

[0101] HRMS (DART) m / z: Calcd for C 29 h 24 N 2 o 7 ,[M+H] +...

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Abstract

The invention provides a colorless polyimide. The chemical structural formula of the colorless polyimide is represented by formula II shown in the description. The invention also provides a preparation method and an application of the polyimide.

Description

technical field [0001] The invention relates to a precursor containing an imide compound and a polyimide prepared by derivative polymerization thereof, which has transparency, high heat resistance, bending resistance and low linear thermal expansion coefficient. The invention also relates to the preparation method of the imide ring-containing compound precursor and the polyimide derived therefrom, as well as the application of the polyimide film, substrate and resin products. Background technique [0002] In recent years, the research of high heat-resistant colorless and transparent polyimide has received more and more attention. It can be used as a flexible substrate in display devices, touch screens, organic photovoltaic cells, flexible electrodes, optical films, and flexible printed circuit boards. Various optoelectronic fields. In particular, as the new generation of display technology tends to be lighter, thinner, and more flexible, transparent polymer materials with l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/40C08J5/18C08L79/08
CPCC08G65/40C08J5/18C08J2371/10
Inventor 房强王元强孙晶
Owner SHANGHAI INST OF ORGANIC CHEM CHINESE ACAD OF SCI
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