Moisture-proof and high strength IC carrier tape material

A high-strength, carrier tape technology, applied in packaging and other directions, can solve problems such as easy breakage, scrapping, device damage, etc., and achieve the effects of good aging resistance, good toughness and high strength

Inactive Publication Date: 2019-08-23
浙江三和塑料有限公司
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The carrier tape material prepared by the above invention patents and known technologies, the surface layer uses PS conductive masterbatch, and the middle layer uses ABPS (acrylonitrile-butadiene-styrene). Since the nitrile group is hydrophilic, the carrier tape can be used during thermoforming. If it is not dried, it is easy to form pits on the surface of the carrier material, resulting in scrapped products, not only easy to break, but also easy to cause device damage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Moisture-proof and high strength IC carrier tape material
  • Moisture-proof and high strength IC carrier tape material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A moisture-proof high-strength IC carrier tape material, the technical solution adopted is:

[0027] According to parts by mass:

[0028] Polystyrene, 55kg;

[0029] High-density polyethylene, 5kg;

[0030] Silicone grafted polyethylene polypropylene fiber, 15kg;

[0031] Aging-resistant linear triembedded copolymer, 3kg;

[0032] Toughener: 3kg;

[0033] Antioxidant: 0.3kg;

[0034] After mixing the above materials evenly, use a twin-screw extruder to granulate to obtain granulated material, and then mix and extrude the granulated material and 3% to 5% black masterbatch to form a carrier tape material;

[0035] The IC carrier tape is divided into three layers, upper, middle and lower, the upper layer and the lower layer are the surface PS conductive masterbatch, the surface PS conductive masterbatch: carrier tape material: PS conductive masterbatch = 1:8:1.

[0036] Described organosilicon-grafted polyethylene polypropylene fibers are grafted according to the fol...

Embodiment 2

[0040] A moisture-proof high-strength IC carrier tape material, the technical solution adopted is:

[0041] According to parts by mass:

[0042] Polystyrene, 60kg;

[0043] High-density polyethylene, 10kg;

[0044] Silicone grafted polyethylene polypropylene fiber, 22kg;

[0045] Aging-resistant linear triembedded copolymer, 2kg;

[0046] Toughener: 1kg;

[0047] Antioxidant: 0.5kg.

[0048] After mixing the above materials evenly, use a twin-screw extruder to granulate to obtain granulated material, and then mix and extrude the granulated material and 3% to 5% black masterbatch to form a carrier tape material;

[0049] The IC carrier tape is divided into three layers, upper, middle and lower, the upper layer and the lower layer are the surface PS conductive masterbatch, the surface PS conductive masterbatch: carrier tape material: PS conductive masterbatch = 1:8:1.

[0050] Described organosilicon-grafted polyethylene polypropylene fiber is prepared according to the fol...

Embodiment 3

[0054] A moisture-proof high-strength IC carrier tape material, the technical solution adopted is:

[0055] According to parts by mass:

[0056] Polystyrene, 75kg;

[0057] High-density polyethylene, 15kg;

[0058] Silicone grafted polyethylene polypropylene fiber, 30kg;

[0059] Aging-resistant linear triembedded copolymer, 8kg;

[0060] Toughener: 5kg;

[0061] Antioxidant: 0.8kg.

[0062] After mixing the above materials evenly, use a twin-screw extruder to granulate to obtain granulated material, and then mix and extrude the granulated material and 3% to 5% black masterbatch to form a carrier tape material;

[0063] The IC carrier tape is divided into three layers, upper, middle and lower, the upper layer and the lower layer are the surface PS conductive masterbatch, the surface PS conductive masterbatch: carrier tape material: PS conductive masterbatch = 1:8:1.

[0064] Described SBPC: Silicone grafted polyethylene polypropylene fibers are grafted according to the fol...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Belonging to the field of material preparation, the invention specifically relates to a moisture-proof and high strength IC carrier tape material. The material is characterized by adopting the technical scheme of: mixing 55-75 parts of polystyrene, 5-15 parts of high density polyethylene, 15-30 parts of organosilicon grafted polyethylene polypropylene, 2-8 parts of an aging-resistant linear triblock copolymer, 1-5 parts of a toughening agent, and 0.3-0.8 part of an antioxidant evenly, then conducting granulation by a twin-screw extruder to obtain a granulated material, and then mixing the granulated material with 3%-5% of black masterbatch and conducting extrusion, thus obtaining the carrier tape material.

Description

technical field [0001] The invention belongs to the field of material preparation; in particular, it relates to a moisture-proof high-strength IC carrier tape material. Background technique [0002] Carrier tape refers to a strip-shaped product used in the field of electronic packaging. It has a specific thickness, and holes (also known as pockets) for holding electronic components are equidistantly distributed along its length direction and are used for indexing. positioning holes. It is widely used as a plastic carrier for the packaging of SMT electronic components such as IC, resistors, inductors, capacitors, connectors, LEDs, fuses, switches, relays, connectors, oscillators, diodes, and triodes. [0003] CN101475721B discloses an antistatic plastic used for SMT carrier tape, a preparation method thereof, and a composite plastic sheet prepared by using the above antistatic plastic. Antistatic plastic used for SMT carrier tape, the antistatic plastic is composed of the f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L25/06C08L23/06C08L23/12C08L53/02C08L83/10B65D73/02C08G77/442
CPCB65D73/02C08G77/442C08L25/06C08L2205/025C08L2205/035C08L2205/06C08L2205/16C08L2207/062C08L2310/00C08L23/06C08L23/12C08L53/02C08L83/10
Inventor 吴中心
Owner 浙江三和塑料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap