Weather-resistant resin composition and applications thereof

A technology of resin composition and weather resistance, applied in the direction of modified epoxy resin adhesive, application, epoxy resin glue, etc., can solve the problems that cannot meet the weather resistance requirements of LED plant lighting substrates, and achieve excellent weather resistance performance, excellent heat dissipation effect

Active Publication Date: 2019-09-03
SHAANXI SHENGYI TECH
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a weather-resistant resin composition and its application to solve the problem that exis

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Weather-resistant resin composition and applications thereof
  • Weather-resistant resin composition and applications thereof
  • Weather-resistant resin composition and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The application provides a weather-resistant resin composition, comprising the following components:

[0038] Component A: silicone hydrogenated epoxy resin;

[0039] Component B: acrylate hydrogenated epoxy resin;

[0040] Component C: alicyclic epoxy resin;

[0041] Component D: hydrogenated anhydride curing agent;

[0042] Component E: curing accelerator.

[0043] Component F: filler;

[0044] Component G: blue light absorber;

[0045] Component H: Additives.

[0046] In the present application, the components and contents of the weather-resistant resin composition are:

[0047] Component A: silicone hydrogenated epoxy resin, 20-40 parts;

[0048] Component B: acrylate hydrogenated epoxy resin, 10-30 parts;

[0049] Component C: alicyclic epoxy resin, 10-30 parts;

[0050] Component D: hydrogenated anhydride curing agent, 40-60 parts;

[0051] Component E: curing accelerator, 0.02 to 0.1 part;

[0052] Component F: filler, 280-540 parts;

[0053] Componen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thermal conductivityaaaaaaaaaa
Peel strengthaaaaaaaaaa
Breakdown voltageaaaaaaaaaa
Login to view more

Abstract

The present invention discloses a weather-resistant resin composition and applications thereof, wherein the weather-resistant resin composition does not contain a phenolic hydroxyl group so as to solve the problems of easy discoloration and aging caused by the phenolic hydroxyl group contained in the existing weather-resistant resin. According to the present invention, with the application of theweather-resistant resin composition to prepare the copper clad laminate, the performance test results show that the prepared copper clad laminate has excellent heat dissipation, excellent heat resistance, excellent adhesion and insulation reliability, the thermal conductivity is up to 3.03 W/m.K, the peeling strength is 1.58 N/mm, the plate cracking time is more than 30 min, the breakdown voltageafter A-state and D-48/50 water boiling treatment is more than 7.0 kV, the performances such as thermal conductivity, peeling strength, breakdown voltage, thermal stress, Tg, Td and the like after blue light irradiation are not significantly attenuated, and the copper clad laminate has excellent weather resistance, such that the obtained product can meet the weather-resistant requirements of LED plant lighting lamps, and is suitable for the preparation of the prepreg, the laminated plate, the copper clad laminates or the printing circuit boards in LED plant lighting.

Description

technical field [0001] The present application relates to the technical field of copper clad laminates, in particular to a weather-resistant resin composition and its application. Background technique [0002] In recent years, LEDs have gradually entered the lives of ordinary people, and LEDs can be seen in various fields of general lighting. LED has advantages that cannot be replaced by traditional lighting, and it also has more room for development. The evolution of the lighting market to the direction based on semiconductor technology has given rise to many new growth opportunities, one of which is plant lighting. LED plant lighting has many advantages, such as increasing the growth rate of crops, saving energy up to 75% and saving water resources up to 90%, etc., which has promoted the development of the plant and horticultural lighting market. [0003] Different from ordinary LED lighting, in order to meet the needs of plants for photosynthesis, the outgoing light wave...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L63/00C08L63/10C08K13/02C08K3/22C08K3/28C08K5/5435C08G59/22C08G59/24C08G59/30C08G59/32C08G59/36C08G59/38C09J163/00C09J163/10B32B15/20B32B7/10
CPCC08L63/00C08L63/10C08G59/306C08G59/24C08G59/223C08G59/226C08G59/3218C08G59/36C08G59/38C08G59/3281C09J163/00C09J163/10B32B15/20B32B7/10C08K2003/282C08K2003/222C08K2003/2227C08L2205/025C08L2205/03C08L2203/20C08L2201/08B32B2457/08C08K13/02C08K3/22C08K3/28C08K5/5435
Inventor 郑浩武伟张记明师剑英
Owner SHAANXI SHENGYI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products