Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A printed circuit board and test fixture

A technology for printed circuit boards and backplanes, which is applied to printed circuits, printed circuit manufacturing, printed circuit components, etc., and can solve problems such as discontinuous impedance, increased test times, and low test efficiency

Active Publication Date: 2021-07-06
SICHUAN JIUZHOU ELECTRIC GROUP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the PIN of the SMA connector is in contact with the crimping of the printed board pad, there is poor contact or partial contact, resulting in discontinuous impedance of the PIN of the SMA and the contact part of the PCB, which leads to low test efficiency and increased test times.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A printed circuit board and test fixture
  • A printed circuit board and test fixture
  • A printed circuit board and test fixture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The embodiments of the present application provide a printed circuit board, which will be described below.

[0020] figure 2 A schematic top plan view of the contact pad of the printed circuit board in the embodiment of the present application is shown.

[0021] Examples of this application figure 2 Taking a single connection point as an example for illustration, as shown in the figure, the printed circuit board includes: a bottom plate, and one or more connection points, the bottom plate includes a plurality of layers, and the one or more connection points are located in the The outermost layer of the bottom plate, each connection point includes a contact pad and a conversion signal hole; the contact pad is connected with the conversion signal hole through a parallel microstrip line; the conversion signal hole is used to connect the other layers of the backplane.

[0022] During specific implementation, the printed circuit board in the embodiments of the present a...

Embodiment 2

[0061] Based on the same inventive concept, an embodiment of the present application provides a test fixture.

[0062] Figure 4 A schematic structural diagram of the test fixture in the embodiment of the present application is shown.

[0063] As shown in the figure, the test fixture includes: the printed circuit board as described in Embodiment 1, and an SMA connector, the PIN of the SMA connector is attached to the contact pad, and the SMA connector has The other end is connected with a transmission line, and the transmission line is used to connect the device under test.

[0064] During specific implementation, the device under test may be a device element such as a connector under test, an oscilloscope, and the like.

[0065] The SMA connector is free of soldering, and can be directly fixed and assembled with the printed circuit board by screws. The contact pad is located in the center of the SMA connector to ensure that the contact pad and the PIN of the SMA connector ...

Embodiment 3

[0078] The embodiments of the present application are described below with a specific example.

[0079] The bottom plate of the PCB is provided with 3 connection points A, B and C, and each connection point includes an SMA contact pad and a conversion signal hole; the SMA contact pad is connected to the conversion through parallel microstrip lines. The signal hole is connected; the conversion signal hole is used to connect different layers of the base plate.

[0080] The radius of the SMA contact pad is 0.2mm-0.4mm, the size of the conversion signal hole is 0.5mm, and the distance from the conversion signal hole to the center of the SMA contact pad is 0.5mm-2mm, The impedance of the conversion signal hole is 50 ohms. The line width of the parallel microstrip line can be calculated according to the impedance, and the impedance of the parallel microstrip line is 50 ohms.

[0081] A GND shielding ring is arranged around the SMA contact pad and the conversion signal hole, the ra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A printed circuit board and test fixture comprising: a base plate, and one or more connection points, the base plate comprising a plurality of layers, the one or more connection points being located on the outermost layer of the base plate, each connection point It includes a contact pad and a conversion signal hole; the contact pad is connected to the conversion signal hole through a parallel microstrip line; the conversion signal hole is used to connect to other layers of the bottom plate. The solution of the present application can ensure complete contact between the SMA connector PIN and the pad of the printed board when crimping, avoiding problems such as poor contact, and ensuring that the impedance of this part is as continuous as possible.

Description

technical field [0001] The present application relates to circuit board technology, and in particular, to a printed circuit board and a test fixture. Background technique [0002] With the rapid development of computer simulation technology, the integration of high-speed products is getting higher and higher, and its corresponding rise time is getting shorter and shorter, and the small changes in the structure and medium during the transmission process will have a great impact on signal transmission. In the design verification process, it is usually necessary to design a special test fixture in order to test the connection between the pins and the port of the network analyzer. In order to reduce the influence of the test board on the DUT, the difficulty of the test fixture lies in the time delay and impedance control of the tested point, SMA (Sub Miniature version A) connector and the test instrument. [0003] The most critical part of the design of the SMA connector and th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02G01R1/04
CPCG01R1/0408G01R1/0416H05K1/0268H05K2203/162
Inventor 许志辉冯立
Owner SICHUAN JIUZHOU ELECTRIC GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com