Wide-band passive high temperature-resistant flexible vibrating sensor and preparation process thereof

Abstract

The invention discloses a wide-band passive high temperature-resistant flexible vibrating sensor which comprises five layers from top to bottom: a high temperature-resistant Al2O3 film packaging layer, a capacitor upper polar plate, a rectangular inductance coil layer, an Al2O3 film dielectric layer, a capacitor lower polar plate layer and a polyimide layer as a substrate. A capacitor lower polarplate is deposited on the polyimide substrate; an aluminium oxide dielectric layer is deposited on the capacitor lower polar plate; the capacitor upper polar plate and an inductance coil are depositedon the aluminium oxide dielectric layer; the capacitor upper polar plate is positioned at the center of the inductance coil; an aluminium oxide packaging layer is deposited on the capacitor upper polar plate and the inductance coil; and a through hole for realizing electric connection between the capacitor lower polar plate and the inductance coil is formed in the aluminium oxide dielectric layer. The polyimide flexible material is used as the substrate, can completely adhere to the surface of a special shaped component, is not easy to fall in vibration when a large device works, and can realize dynamic precise measurement of vibration parameters of the surface of the special shaped component.

Description

technical field [0001] The invention relates to the field of vibration sensors, in particular to a broadband passive high temperature resistant flexible vibration sensor and a preparation process thereof. Background technique [0002] With the continuous development of science and technology in our country, in the process of large-scale equipment manufacturing and operation, the requirements for the ability to dynamically monitor the complex surface vibration parameters of special heterogeneous components in extreme environments (-50 ° C ~ 300 ° C) are increasingly demanding, and it has become one of the The key technical "bottleneck" of performance improvement. Because the traditional vibration sensor is based on a non-flexible substrate, it cannot be closely attached to the surface of different components, and it is easy to fall off under working conditions, and the wired test method has problems such as poor contact of contacts and distortion of test results in extreme en...

AI Technical Summary

Problems solved by technology

Because the traditional vibration sensor is based on a non-flexible substrate, it cannot be closely attached to the surface of different components, and it is easy to fall off under working conditions, and the wired test method has problems such as poor contact contact and distortion of test results in extreme environments.

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