Wafer arrangement system and method based on two-dimensional ultrasonic comb

Abstract

The invention discloses a wafer arrangement system based on a two-dimensional ultrasonic comb. First ultrasonic transducer arrays are arranged on two opposite sides of a fixed substrate along an x axis, and comprise first ultrasonic transducers being in one-to-one correspondence along the x axis; and second ultrasonic transducer arrays are arranged along two opposite sides of the fixed substrate along a y axis, and comprise second ultrasonic transducers being in one-to-one correspondence along the y axis. The first ultrasonic transducer arrays and the second ultrasonic transducer arrays can form a two-dimensional standing wave sound field on the surface of the fixed substrate to position a wafer, the first ultrasonic transducer arrays can form a first offset traveling wave field distributed along the x axis to achieve the uniform distribution of the wafers in the x axis direction; and the second ultrasonic transducer arrays can form a second offset traveling wave field distributed along the y axis so as to achieve the uniform distribution of the wafers in the y axis direction, thereby achieving the uniform arrangement of the wafers on the surface of the fixed substrate. The invention also provides a wafer arrangement method, and the wafer arrangement method also has the beneficial effects.

Description

technical field [0001] The invention relates to the technical field of electronic semiconductors, in particular to a wafer arrangement system based on a two-dimensional ultrasonic comb and a wafer arrangement method based on a two-dimensional ultrasonic comb. Background technique [0002] In the 21st century, the global lighting industry has entered a new era led by LED lighting. The market demand for LEDs is increasing year by year. Therefore, the global Micro-LED (micro-light-emitting diode) market is growing rapidly, and it will still have a high speed in the future. growing trend. In recent years, Micro-LED has received more and more attention because of its high brightness, low power consumption, ultra-high resolution and color saturation. The size of the resulting wafer is only 1-10 μm. Due to the small size and pitch of the chip, Micro-LED can achieve high ppi in terms of image quality, so its application on small and medium-sized display screens such as mobile phon...

AI Technical Summary

Problems solved by technology

Since the size of Micro-LEDs is at the micron level, one of the biggest problems restricting the production of Micro-LEDs is the huge micro-transfer of wafers, that is, to accurately grasp the Micro-LED wafers of micron-sized size from the donor wafer, and to expand the array distance , properly placed and fixed on the target substrate, it takes 2-15 weeks to make a display with the traditional method of picking and placing LED chips by manipulators, which is far from meeting the needs of industrialization. Therefore, it is urgent to propose new methods to improve Micro-LED transfer efficiency, accurate wafer placement to improve the development pace of Micro-LED display technology

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