Tin alloy plating solution

A technology of tin alloy and plating solution, which is applied in the direction of semiconductor devices, circuits, etc., can solve the problems of the appearance of the coating film and the uniformity of the film thickness, the problems of easy decomposition and precipitation of silver, etc., and achieve good appearance and uniformity of the film thickness Excellent stability, excellent bendability and reflowability
CN110249076AInactive Publication Date: 2019-09-17MITSUBISHI MATERIALS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MITSUBISHI MATERIALS CORP
Publication Date
2019-09-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

A tin alloy plating solution comprising a soluble tin salt, a soluble salt of a metal more precious than tin, and a sulfide compound represented by general formula (1). In formula (1), n is 1 to 3. The metal more precious than tin is preferably silver, copper, gold, or bismuth. HO-CH<2>CH<2>-S-(CH<2>CH<2>-O-CH<2>CH<2>-S)<n>-CH<2>CH<2>-OH (1).
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Description

technical field

[0001] The invention relates to a tin alloy plating solution for forming a tin alloy plating film by an electroplating method. More specifically, it relates to a tin alloy plating solution suitable for forming solder bumps for semiconductor wafers and printed circuit boards. In addition, this international application claim is based on Japanese Patent Application No. 15219 (Patent Application 2017-15219) filed on January 31, 2017 and Japanese Patent Application No. 222433 (Patent Application 2017-222433) filed on November 20, 2017 Priority right of patent application 2017-15219 and patent application 2017-222433 are used in this international application. Background technique

[0002] It is known that in a tin alloy plating bath (liquid) for forming a tin alloy coating film on a conductive object, such as a tin-silver alloy coating film, there is a large difference in redox potential between tin ions and other metal ions (such as silver ions) in the bath. W...

Claims

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