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Processing method of earphone dust-proof cover

A processing method and technology of dust cover, applied in the field of processing of earpiece dust cover, can solve the problems of complex processing procedure, unstable mesh structure, low product yield, etc., achieve stable microporous structure, and improve product yield. , Save the effect of weaving

Active Publication Date: 2019-09-20
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to propose a processing method of earpiece dust cover to solve the problems of complicated processing procedure, unstable mesh structure and low product yield rate of the existing mobile phone earpiece dust cover

Method used

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  • Processing method of earphone dust-proof cover
  • Processing method of earphone dust-proof cover
  • Processing method of earphone dust-proof cover

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Such as figure 1 As shown, the embodiment of the present invention provides a method for processing the earpiece dust cover, including:

[0055] S1. Obtain a stainless steel sheet, and identify the thickness of the stainless steel sheet.

[0056]In the above step S1, the stainless steel sheet is used as the base material of the dustproof cover of the earpiece, one of the surfaces will be the surface of the dustproof bottom, and the other surface will be the surface of the dustproof main body of the earpiece. The above two surfaces in the stainless steel sheet are The two opposite surfaces, and the distance between the above two surfaces, is the thickness of the stainless steel sheet.

[0057] S2. Processing the stainless steel sheet into a dustproof cover for the earpiece by stamping and forming, the dustproof cover for the earpiece includes a dustproof bottom and a dustproof main body of the earpiece integrally formed with the dustproof bottom.

[0058] In the above ...

Embodiment 2

[0075] Such as Figure 4 As shown, the embodiment of the present invention also shows a schematic flowchart of the detailed implementation of step S3 in the method for processing the earpiece dust cover provided in the first embodiment.

[0076] In an embodiment of the present invention, step S3 may include:

[0077] S31. Using the processing point as the center point of the microhole.

[0078] S32. When marking the processing points on the surface of the dust-proof bottom, adjust the distance between the two processing points according to the thickness of the stainless steel sheet.

[0079] In the above step S31 and step S32, the distance between the two processing points is the sum of the diameter of the microhole and the preset spacing, and the preset spacing and the diameter of the microhole are the same as that of the stainless steel sheet corresponding to the thickness.

[0080] In a specific application, the distance between two processing points is the distance betw...

Embodiment 3

[0088] The embodiment of the present invention exemplarily shows two specific implementations of step S4 in the first embodiment, the first specific implementation is:

[0089] When the thickness of the stainless steel sheet is 0.07mm to 0.15mm, an ultraviolet picosecond laser with a wavelength of 355nm is used;

[0090] Adjust the laser processing parameters of the ultraviolet picosecond laser;

[0091] Adjusting the laser focal length of the ultraviolet picosecond laser so that the laser focus is in contact with the processing point;

[0092] The ultraviolet picosecond laser is used to successively peel off the stainless steel material at the processing point.

[0093] In specific applications, the maximum power of the ultraviolet picosecond laser is 8W, and the laser marking range is 100mm×100mm. The principle of this laser is to repeatedly act on the metal surface, so that the metal is peeled off one by one, and finally the desired effect is achieved. The advantage is the...

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Abstract

The invention is applicable to the technical field of mobile phone component processing, and provides a processing method of an earphone dust-proof cover. The processing method comprises the following steps that S1, a stainless steel sheet is obtained, and the thickness of the stainless steel sheet is identified; S2, the stainless steel sheet is subjected to stamping forming to form the earphone dust-proof cover, wherein the earphone dust-proof cover comprises a dust-proof bottom and an earphone dust-proof main body which is integrally formed with the dust-proof bottom, the surface of the dust-proof bottom is a surface of the stainless steel sheet, the surface of the earphone dust-proof main body is the other surface of the stainless steel sheet, and the distance between the two surfaces is the thickness of the stainless steel sheet; S3, processing points are marked on the surface of the dust-proof bottom according to the thickness of the stainless steel sheet; S4, the laser processing mode is selected according to the thickness of the stainless steel sheet, so that laser focus are in contact with the processing points; and S5, a pre-written micro-hole processing program is loaded and executed, and micro holes are formed in the dust-proof bottom and the earphone dust-proof main body. According to the processing method, procedures such as weaving, pasting or welding of a dust-proof net can be omitted, the product yield is improved, and the products are integrally formed.

Description

technical field [0001] The invention relates to the technical field of mobile phone parts processing, in particular to a processing method for an earpiece dust cover. Background technique [0002] The dust-proof part of the traditional special-shaped mobile phone earpiece dust cover is a mesh structure, which adopts a weaving process, which requires relatively high technical requirements for the production staff and requires special technical training to make it. The production process is complicated and the production cycle is long, so the product yield rate lower. With the development of industrial science and technology, there are mainly the following processing methods for the dust cover of mobile phone earpieces: [0003] 1. Planar mesh structure: mainly woven metal mesh or fiber mesh, but the screens of mainstream mobile phone products have a certain thickness, using metal mesh or fiber mesh will cause obvious depressions at the handset of the mobile phone, resulting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 陈爽田征彭云贵胡述旭曹洪涛高云峰
Owner HANS LASER TECH IND GRP CO LTD
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