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Molding method of foaming silicone material with high heat conductivity

A technology of foamed silica gel and molding method, applied in the field of foamed silica gel, can solve the problems of complicated operation, low thermal conductivity, long operation time, etc., and achieve the effects of wide application range, high thermal conductivity and energy saving

Pending Publication Date: 2019-10-01
浙江天易新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current heat-conducting foamed silicone material has some technical deficiencies: ①The thermal conductivity is not high (≤0.8W / k.m), and it cannot withstand high temperature for a long time after molding, resulting in deformation; ②It needs to be vulcanized twice, and it needs It is first foamed at a low temperature of 100~150°C, and then thoroughly cured at a high temperature of 150~180°C. The operation is cumbersome, there are many vulcanization steps, and the operation time is long, which is not conducive to mass production; consume too much

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A molding method of a high thermal conductivity foamed silica gel material 1, comprising 70 parts of methyl vinyl silicone oil, 10 parts of aluminum oxide, 5 parts of boron nitride, 5 parts of graphene, 10 parts of dimethyl silicone oil, and 15 parts of hydrogen-containing silicone oil , 3 parts of dispersant, 5 parts of blowing agent, 5 parts of inhibitor (acetylene cyclohexanol), 5 parts of Castel platinum catalyst. Heat methylvinyl silicone oil, dimethyl silicone oil, and hydrogen-containing silicone oil to 100°C and stir in a dispersion mixer to obtain a silica gel mixture. Put the silica gel mixture into the dispersion mixer again and add alumina, boron nitride, and graphene in sequence , foaming agent, dispersant, inhibitor, disperse and stir, stir for 5 minutes, add platinum catalyst and stir again, take it out after 20 minutes to obtain a high thermal conductivity foamed silica gel mixture. Put the high thermal conductivity foamed silica gel mixture into the liq...

Embodiment 2

[0023] A molding method of high thermal conductivity foamed silica gel material 2, comprising 85 parts of methyl vinyl silicone oil, 18 parts of aluminum oxide, 5 parts of boron nitride, 10 parts of graphene, 20 parts of dimethyl silicone oil, and 30 parts of hydrogen-containing silicone oil , 5 parts of dispersant, 10 parts of foaming agent, 10 parts of inhibitor (2-methyl-3-yn-2-ol), 10 parts of Castel platinum catalyst. Heat methylvinyl silicone oil, dimethyl silicone oil, and hydrogen-containing silicone oil to 150°C and stir in a dispersion mixer to obtain a silica gel mixture. Put the silica gel mixture into the dispersion mixer again and add alumina, boron nitride, and graphene in sequence. , foaming agent, dispersant, inhibitor, disperse and stir, stir for 10 minutes, add the platinum catalyst and stir again, take it out after 30 minutes to obtain a high thermal conductivity foamed silica gel mixture. Put the high thermal conductivity foamed silica gel mixture into the...

Embodiment 3

[0029] A molding method of high thermal conductivity foamed silica gel material 3, comprising 75 parts of methyl vinyl silicone oil, 15 parts of aluminum oxide, 10 parts of boron nitride, 5 parts of graphene, 15 parts of dimethyl silicone oil, and 20 parts of hydrogen-containing silicone oil , 4 parts of dispersant, 8 parts of blowing agent, 8 parts of inhibitor (3-methyl-1-yn-3-ol), 8 parts of Custer platinum catalyst. Heat methylvinyl silicone oil, dimethyl silicone oil, and hydrogen-containing silicone oil to 130°C and stir in a dispersion mixer to obtain a silica gel mixture. Put the silica gel mixture into the dispersion mixer again and add alumina, boron nitride, and graphene in sequence. , foaming agent, dispersant, inhibitor, disperse and stir, stir for 7 minutes, add the platinum catalyst and stir again, take it out after 25 minutes to obtain a high thermal conductivity foamed silica gel mixture. Put the high thermal conductivity foamed silica gel mixture into a liqui...

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PUM

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Abstract

The invention relates to the field of foaming silicone, which aims at solving the problems of low heat conductivity and two times of vulcanization molding in the existing heat-conduction foaming silicone material. New-energy source foaming silicone material with high heat conductivity is prepared by the following steps of uniformly stirring and dispersing methyl vinyl silicone oil, aluminum oxide,boron nitride, graphene, dimethyl silicone oil, hydrogen-containing silicone oil, a dispersant, a foaming agent, an inhibitor and a platinum catalyst; putting into a liquid calendering machine to calendar, and discharging tablets; flatly putting the tablets into a baking passage to bake for 10 to 15min at the baking temperature of 80 to 150 DEG C. The foaming silicone material with high heat conductivity has the advantages that after primary vulcanization molding, the production time is effectively shortened by about 30%, and the energy source is saved by 20%; the heat conductivity is high, and the application range is broad.

Description

technical field [0001] The invention relates to the field of foamed silica gel, in particular to a molding method of a foamed silica gel material with high thermal conductivity. Background technique [0002] Thermally conductive foamed silica gel is a chemically inert elastic material with excellent high and low temperature resistance and temperature-variable impact resistance. Thermally conductive foamed silicone combines the dual physical and chemical properties of foamed silicone and thermally conductive silicone gaskets, and has dual functions of cushioning and heat conduction. It has broad application prospects in OLED screens, cameras and other scenarios; and it can be used in the packaging and filling of lithium batteries in new energy vehicles, precision instruments, consumer electronics and other products, so as to fix the battery block, reduce the working temperature of the battery, and reduce the weight of the battery; at the same time, it can Reduce assembly ope...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08L83/05C08K13/02C08K3/22C08K3/38C08K3/04C08K5/41C08J9/10
CPCC08J9/0033C08J9/0061C08J9/0066C08J9/0095C08J9/103C08J2203/04C08J2383/07C08J2483/04C08J2483/05
Inventor 陈斌李志芳
Owner 浙江天易新材料有限公司