Solder composition for dispensing coating

A composition and solder technology, applied in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of easy dripping and low viscosity of the solder composition, and achieve the effect of suppressing dripping

Inactive Publication Date: 2019-10-11
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the viscosity of the solder composition for dispensing coating is lower than that of the solder composition used in the printing method, dripping ten

Method used

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  • Solder composition for dispensing coating
  • Solder composition for dispensing coating
  • Solder composition for dispensing coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] Rosin-based resin A 22 mass%, rosin-based resin B 7 mass%, rosin-based resin C 8 mass%, thixotropic agent A 6.6 mass%, thixotropic agent B 1.8 mass%, antioxidant A 0.9 mass%, anti-oxidant 1.8% by mass of oxygen agent B, 0.5% by mass of activator A, 4% by mass of activator B, 1% by mass of activator C, 1.8% by mass of imidazole compound A, 0.4% by mass of pyrazole compound, 32.3% by mass of solvent A, and solvent 11.9% by mass of B was put into a container, heated to 160° C. with a mantle heater, and mixed with a kneader (planetary mixer) to obtain a flux composition.

[0114] Then, 14.8% by mass of the obtained flux composition and 85.2% by mass of the solder powder (100% by mass in total) were put into a container and mixed with a kneader (planetary mixer) to prepare a solder composition.

[0115] In addition, the obtained solder composition was measured with an E-type viscometer in accordance with JIS Z3284 Attachment 6. The rotational speed was set at 10 rpm, the te...

Embodiment 2～6 and comparative example 1～3

[0119] A solder composition was obtained in the same manner as in Example 1, except that each material was blended according to the composition shown in Table 1.

[0120] Moreover, about the obtained solder composition, the viscosity and the thixotropic index were measured similarly to Example 1.

[0121]

[0122] The performance of the solder composition (coatability, heating drop, ball near chip) was evaluated or measured by the following methods. Table 1 shows the obtained results.

[0123] (1) Coatability

[0124] Using a dispensing coating device ("SHOT mini" manufactured by Musashi Engineering Co., Ltd.), under the following coating conditions, a 100mm x 100mm coating on a substrate (material: aluminum, size: 150mm x 150mm, thickness: 0.5mm) Discharging of 10,000 points (100 points×100 rows) was performed at equal intervals within the range to obtain a test substrate.

[0125] Nozzle diameter (diameter) of the needle: 0.4mm

[0126] Pressure in extrusion part: 120k...

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Abstract

This solder composition for dispensing and coating contains a flux composition and (G) a solder powder. The flux composition contains (A) a rosin-based resin, (B) an activator, (C) a solvent, (D) a thixotropic agent, and (E) an imidazole compound, and has a viscosity of 50-120 Pa * s at 25 DEG C as measured by an E-type viscometer.

Description

technical field [0001] The present invention relates to a solder composition for dispensing coating. Background technique [0002] In electronic devices, when connecting electronic components to a wiring board, a solder composition (so-called solder paste) is used. The solder composition is a mixture obtained by kneading solder powder, a rosin resin, an activator, a solvent, and the like to form a paste. Solder bumps can be formed by applying this solder composition on a wiring board and then performing a solder reflow process. Here, the coating method is usually screen printing or the like, but coating in various coating methods is required, and in recent years, coating by a dispensing coating method is required. [0003] Furthermore, as a solder composition for dispensing coating, for example, a gold-tin alloy solder paste having a solder paste viscosity exceeding 50 to 120 Pa·s has been proposed (reference document 1: JP 2009-241126 A). [0004] The solder composition ...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/36
CPCB23K35/3612B23K35/3618B23K35/362
Inventor 杉山功大内克利
Owner TAMURA KK
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