Low-pressure diffusion and low-temperature oxidation gettering process
A low-pressure, low-temperature technology, applied in the field of new low-pressure diffusion low-temperature oxidation gettering process, can solve the problem that the substrate gettering effect is not particularly significant, and achieve the effect of satisfying phosphorus diffusion requirements, optimizing diffusion process, and improving gettering ability.
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[0016] Example 1: A low-pressure diffusion and low-temperature oxidation gettering process, including low-temperature and normal-pressure boat feeding, rapid low-pressure heating, high-temperature and normal-pressure stabilization, high-temperature and low-pressure oxidation, 4 steps of high-temperature and low-pressure source and junction push, long-term cooling and oxidation gettering , Rapid atmospheric pressure cooling and low temperature deposition, low temperature out of the boat steps, the specific steps are as follows:
[0017] (1) Low temperature and normal pressure feeding boat: put the textured monocrystalline silicon wafer into the diffusion furnace, set the temperature of the furnace tube at 780°C and normal pressure, and feed 5 to 8 L / min of N 2 ;
[0018] (2) Rapid temperature rise at low pressure: set the low pressure to 80-100, and the furnace tube will rapidly heat up to 780-785°C for 3 minutes;
[0019] (3) Stable high temperature and normal pressure: under...
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