Circuit structure for membrane laminating injection molding and manufacturing method thereof
A circuit structure, injection molding technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit assembly of electrical components, etc., can solve the problems of integrated circuit board environmental pollution, poor waterproof performance, poor impact resistance, etc., to achieve Less manufacturing process, simple structure and strong impact resistance
Active Publication Date: 2019-10-11
深圳市恒翊科技有限公司
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Problems solved by technology
[0002] The exterior structures of traditional household appliances, automotive interior parts, consumer electronics, etc. are assembled from plastic parts and integrated circuit boards behind the plastic parts. The integrated circuit board is composed of printed circuit boards (empty boards) and soldered The electronic components on the printed circuit board have disadvantages such as complex structure, heavy volume, cumbersome manufacturing process, poor waterproof performance, weak weather resistance, and poor impact resistance, and there is environmental pollution in the printing and production of integrated circuit boards. question
Method used
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. In the description of the present invention, it should be noted that, unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection , it can be mechanical connection, electrical connection, direct connection, indirect connection through an intermediary, or internal connection between two components; "printed on XXX" should ...
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The invention provides a circuit structure for membrane laminating injection molding and a manufacturing method thereof. The method comprises the following steps: printing conductive ink on one surface of a membrane to form a conductive circuit, wherein the conductive circuit is provided with at least one contact pad; printing insulating ink, avoiding the contact pads, on the conductive circuit toform a first insulating layer, and mounting electronic components and parts on corresponding contact pads; forming and trimming the membrane; positioning and putting the trimmed membrane and connectors into a mold, wherein the connectors are laminated with the corresponding contact pads in a contact mode; providing an injection molding material into the mold, carrying out injection molding on thesurface, with the electronic components and parts, of the membrane to form an injection molding layer, and enabling a part of the connectors to be embedded into the injection molding layer. The circuit structure obtained by using the manufacturing is an inseparable component, and has the advantages of moisture prevention, high weather resistance and high impact resistance. The conductive circuitis formed by printing conductive ink, and the manufacturing technology is few in working procedures and environmentally-friendly. The circuit structure is stereoscopic and diversified in molding and simple in structure.
Description
technical field [0001] The invention relates to the technical field of printed electronics, in particular to a film-coated injection-molded circuit structure and a manufacturing method thereof. Background technique [0002] The exterior structures of traditional household appliances, automotive interior parts, consumer electronics, etc. are assembled from plastic parts and integrated circuit boards behind the plastic parts. The integrated circuit board is composed of printed circuit boards (empty boards) and soldered The electronic components on the printed circuit board have disadvantages such as complex structure, heavy volume, cumbersome manufacturing process, poor waterproof performance, weak weather resistance, and poor impact resistance, and there is environmental pollution in the printing and production of integrated circuit boards. question. Contents of the invention [0003] Aiming at the problems and defects in the above-mentioned traditional process of making t...
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Patent Timeline
Login to View More IPC IPC(8): H05K3/00H05K3/12H05K3/32
CPCH05K3/0014H05K3/12H05K3/321H05K2203/1316
Inventor 何不同谢冠瑶
Owner 深圳市恒翊科技有限公司