Evaporation plating device and evaporation plating method

Abstract

The invention discloses an evaporation plating device and an evaporation plating method. The evaporation plating device comprises a film plating chamber, a crucible which is arranged at the bottom ofthe film plating chamber and used for containing and heating film plating materials and a fixture which is arranged on the top of the film plating chamber, is opposite to the crucible and is used forclamping a to-be-plated product; and the bottom of the film plating chamber is provided with at least one first air inlet hole, inert gas is introduced into the film plating chamber through the firstair inlet holes, and the film plating chamber is provided with at least one exhaust hole. The film plating materials are heated to be sublimated and gasified, diffused out from the crucible and then driven by the inert gas to quickly move towards the to-be-plated product, the film plating speed is higher, and the production efficiency is high. In the evaporation plating material gasifying and moving process, the evaporation plating materials can be mixed uniformly through the inert gas, therefore, the density of all areas of the evaporation plating materials is more consistent before the evaporation plating materials are plated on the to-be-plated product, the film plating uniformity is good, the film forming quality is better, and the precision is higher.

Description

technical field [0001] The present application relates to the field of display technology, in particular to an evaporation device and an evaporation method. Background technique [0002] Evaporation devices are widely used in various coating processes. Taking Organic Light-Emitting Diode (OLED) as an example, because OLED has active light emission, no backlight, wide viewing angle, high contrast, and fast response , Wearable, wide operating temperature range, simple structure and manufacturing process, etc., have received extensive attention in the field of display technology. [0003] Compared with TFT-LCD, OLED has obvious disadvantages in terms of production cost, especially in the evaporation process of OLED, vacuum evaporation is generally used, and after the evaporation material is sublimated and vaporized in a vacuum environment, the uniformity is poor and the movement is slow , the coating uniformity is poor, and the production efficiency is low. Contents of the i...

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Problems solved by technology

[0003] Compared with TFT-LCD, OLED has obvious disadvantages in terms of production cost, especially in the evaporation process of OLED, vacuum evaporation is generally used, and the evaporation material has poor uniformity and slow movement after sublimation and gasification in a vacuum environment. , poor coating uniformity, low production efficiency

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