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Fabrication method for PCB having local electrical thick gold PAD

A production method and technique of electro-thickness gold, applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, electrical components, etc. and good performance

Active Publication Date: 2019-10-18
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at above-mentioned existing technical defect, provides a kind of manufacturing method of PCB with partial electric thick gold PAD, this method optimizes the manufacturing process, solves the seepage problem that exists when making partial electric thick gold PAD, ensures The appearance quality and performance of the PCB are good

Method used

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Examples

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Embodiment

[0029] The manufacturing method of a kind of PCB with partial electrical thick gold PAD shown in this embodiment, comprises the following processing steps in sequence:

[0030] (1) Cutting: Cut out the core board according to the panel size of 520mm×620mm. The thickness of the core board is 1.1mm, and the thickness of the copper layer on both surfaces of the core board is 0.5OZ.

[0031] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit; inner layer etching, etch out the inner layer circuit on the core board after exposure and development, and measure the inner layer line width to 3mil; inner layer AOI, and then check the open and short circuit of the inner layer...

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Abstract

The invention discloses a fabrication method for PCB having local electrical thick gold PAD. The fabrication method comprises the following steps of performing pad pasting on a production plate, and forming an outer-layer circuit pattern after exposure and developing, wherein the outer-layer circuit pattern comprises PAD; etching to remove a copper layer at a non-outer layer circuit pattern, and obtaining an outer-layer circuit after film withdrawing; plating a thin copper layer on a panel by copper deposition and full-board electroplating; filling a panel of a non-outer layer circuit part with an electrical-resistant gold ink, and allowing an upper end of the electrical-resistant gold ink to be flush with an upper end of the outer-layer circuit; performing pad pasting on the production plate, and forming a window in a position corresponding to the PAD; electroplating nickel and thin gold on the PAD, and then electroplating thick gold on the PAD; sequentially stripping a film and the electrical-resistant gold ink on the production plate; removing a thin copper layer by etching, and making the outer-layer circuit again; and performing post-process treatment to obtain the PCB. By themethod, the fabrication process flow is optimized, the problem of diffusion coating during fabrication of the local electrical thick gold PAD is solved, and the appearance quality and favorable performance of the PCB are ensured.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing a PCB with a local electric thick gold PAD. Background technique [0002] The PAD in the PCB means the pad, which is the part where the PCB and the component pins are welded to each other. It is manifested as some exposed metal surfaces with strict requirements on size and shape. The key is to expose the metal and not be covered by solder mask. The PAD position generally requires electro-thick gold treatment, that is, a certain thickness of gold layer is plated on the basis of electroplating nickel gold to provide good wear resistance, corrosion resistance and solderability. [0003] The conventional manufacturing method of PCB with partial electrical thick gold PAD includes: pre-process → copper sinking, board electrical → outer layer graphics 1 (making PAD graphics) → graphics nickel gold → electrical thick gold → film remo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/10H05K3/06
CPCH05K3/06H05K3/108H05K3/18
Inventor 寻瑞平李显流龚海波徐文中
Owner JIANGMEN SUNTAK CIRCUIT TECH
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