MEMS device and preparation method thereof

Abstract

The invention provides an MEMS device and a preparation method thereof. The MEMS device and the preparation method thereof are characterized in that a vibrating diaphragm is formed on the front surface of a substrate; the vibrating diaphragm is insulated and isolated from the substrate; a plurality of through holes are formed in the back surface of the substrate; the gap communicated with the through holes is formed between the substrate and the vibrating diaphragm; the substrate serves as a polar plate; the through holes serve as sound holes; and the substrate, the through holes, the vibrating diaphragm and the gap form the MEMS device, so that manufacturing of the polar plate and an insulating layer is omitted, and process steps are saved, and then the manufacturing cost of the MEMS device is saved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a MEMS device and a preparation method thereof. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology refers to a micro-system that can integrate mechanical components, drive components, optical systems, and electronic control systems into a whole. It uses microelectronics technology and micromachining technology ( Such as silicon body micromachining, silicon surface micromachining, wafer bonding, etc.) combined manufacturing process, to produce a variety of excellent performance, low price, miniaturized sensors (such as inertial sensors, pressure sensors, acceleration sensors, etc.), execution drives, drives and microsystems. [0003] Existing MEMS devices generally include a base, the base has a front and a back, and the base has a back cavity that runs through the front and the back, a vibrating membrane is for...

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Problems solved by technology

[0004]However, in MEMS devices, there are relatively high requirements for the bearing capacity of the vibrating membrane and the polar plate, or the rigidity of the vibrating membrane and the polar plate, so as to avoid The problem of damage or rupture of the vibrating film or plate occurs during use, and in order to solve this problem, some measures need to be taken, such as improving the material of the vibrating film or plate, or improving the process conditions for forming the vibrating film or plate, etc. Therefore, it will inevitably increase the production cost of MEMS devices.

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