Ceramic light-emitting surface CSP LED packaging process

Abstract

The invention discloses a ceramic light-emitting surface CSP LED packaging process. By adopting the packaging process with the downward light-emitting surface, a fluorescent ceramic chip can be used as a component of the whole CSP LED and also can be used as a carrier plate for positioning an LED chip, so compared with the ceramic light-emitting surface CSP LED packaging process in the prior art,a substrate does not need to be added, and the thickness of the product is reduced to 0.27-0.3mm from 0.7-0.8mm, the production cost, the process steps and the process difficulty are greatly reduced,the application range is extended and the production efficiency is greatly improved. The ceramic light-emitting surface CSP LED packaging process has great economic value and is suitable for CSP LEDs.

Description

Technical field [0001] The invention relates to the field of CSP LEDs, in particular to a ceramic light-emitting surface CSP LED packaging process. Background technique [0002] LED, also known as light-emitting diode, is a semiconductor device that can convert electrical energy into visible light. As a new type of light source, LED is incapable of traditional light sources such as high efficiency, energy saving, environmental protection, long life, fast start-up speed, and no flicker. The advantages of comparison have achieved rapid development, and the application fields involve the production of daily household appliances and machinery such as mobile phones, lamps, home appliances, etc., in which CSP packaging technology is mainly used to package light-emitting elements. The full name of CSP is Chip Scale Package, which refers to a fully functional packaged device with a ratio of package size to chip size not greater than 1.2 times. Therefore, the CSP packaged LED has a small ...

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Problems solved by technology

[0003] The materials of the light-emitting surface of LED include silica gel and ceramics. The service life of CSP LED on the light-emitting surface of silica gel is generally 50,000 hours, the cost is low, the packaging is simple, and there are defects of poor heat resistance and easy aging, while the life of CSP LED on the light-emitting surface of ceramic is generally 10 hours. 10,000 hours, good heat resistance, stable work, but the substrate needs to be added when packaging, the thickness of the substrate is usually about 0.5mm, not only the processing difficulty and production cost increase, but also the product volume increases, the total thickness reaches 0.7-0.8mm, and the packaging effect is poor , takes up a lot of space, although the performance of CSP LEDs with ceramic light-emitting surfaces is better than that of CSP LEDs with silicone light-emitting surfaces, there are relatively large limitations in both production and application of CSP LEDs with ceramic light-emitting surfaces.

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