Semiconductor wafer electroplating clamping device

Abstract

The invention discloses a semiconductor wafer electroplating clamping device. The device comprises a worktable, a hydraulic rod, a cylinder, a clamping main plate and an electroplating disc; the worktable is of an L-shaped structure, a transverse through bottom groove with a rectangular structure is formed in the bottom end surface of the inner side, a hydraulic rod is mounted on the side, far from the vertical end, of the top end surface of the outer side, and a support top plate is arranged on the top end surface of the inner side; the bottom end of a piston rod of the hydraulic rod penetrates through the worktable, and is fixedly welded with the support top plate; a motor vertically arranged is welded at the bottom end of the support top plate; and a machine shaft of the motor is connected with stirring blades through a support base plate. The semiconductor wafer electroplating clamping device can stir electroplating liquid in an electroplating tank, can guarantee full stirring andflowing of the electroplating liquid to guarantee the electroplating deposition thickness uniformity and to improve the electroplating effect, and finishes the clamping through cylinder pushing to achieve a better and more stable clamping effect.

Description

technical field [0001] The invention belongs to the technical field of semiconductor wafer electroplating, and in particular relates to a semiconductor wafer electroplating clamping device. Background technique [0002] In the production process of semiconductor integrated circuits, it is necessary to electroplate the surface of the wafer to form a metal layer. Therefore, wafer electroplating is one of the key links in the semiconductor wafer manufacturing process. The process is to place the wafer in the electroplating solution, connect the negative voltage to the wafer as the cathode, and connect the positive voltage to the soluble or insoluble anode. , the metal ions in the electroplating solution are deposited on the surface of the wafer through the action of an electric field. . [0003] In the electroplating process of semiconductor wafers, electroplating fixtures are used to clamp and fix the wafers. However, the existing clamping devices have poor clamping effects ...

AI Technical Summary

Problems solved by technology

[0003] In the electroplating process of semiconductor wafers, electroplating fixtures are used to clamp and fix the wafers. However, the existing clamping devices have poor clamping effects and are prone to excessive force during the clamping process, resulting in damage to the wafers. The wear of the wafer, and the wafer is in the clamping process, the existing clamping device, when it is clamped and placed, the wafer is electroplated, and it is also easily blocked by the wafer clamp, resulting in poor electroplating effect. And it is impossible to ensure that the electroplating solution is fully stirred during electroplating

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