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A substrate edge protection ring unit, photolithography equipment and protection method

A technology of edge protection and lithography equipment, applied in the field of substrate edge protection ring unit, can solve the problems of increased labor costs, difficulty in ensuring accurate accuracy, and low ring release efficiency, so as to improve ring release accuracy, improve ring release efficiency and equipment Yield, solve the effect of low precision

Active Publication Date: 2021-01-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to ensure the alignment accuracy by manual ring release, and the ring release efficiency is low, the equipment productivity is not high, and the labor cost is increased at the same time

Method used

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  • A substrate edge protection ring unit, photolithography equipment and protection method
  • A substrate edge protection ring unit, photolithography equipment and protection method
  • A substrate edge protection ring unit, photolithography equipment and protection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Embodiment 1 of the present invention provides a base edge protection ring unit, figure 1 is a schematic diagram of the guard ring in the base edge guard ring unit in Embodiment 1 of the present invention, figure 2 is a schematic diagram of the protective ring tray in the base edge protective ring unit in Embodiment 1 of the present invention, image 3 is a schematic diagram of the base edge protection ring unit in Embodiment 1 of the present invention. refer to figure 1 , figure 2 and image 3 , the substrate edge guard ring unit 100 includes a guard ring 110 and a guard ring tray 120 . Wherein, the protection ring is a kind of light-shielding shielding object whose central part is hollowed out and whose edges are solid. The outer diameter of the protective ring 110 is slightly larger than the diameter of the substrate, and the inner diameter of the protective ring 110 may be the inner diameter of the area on the substrate that needs to be shielded.

[0065] Th...

Embodiment 2

[0074] Embodiment 2 of the present invention provides a protection ring library unit, Figure 6 It is a schematic diagram of the protection ring library unit in the second embodiment of the present invention, which is used to store the base edge protection ring unit as described in the first embodiment of the present invention. The protection ring library unit 200 includes:

[0075] The protection ring storage 220 , the protection ring storage 220 is provided with several ring storage spaces for storing several protection rings 110 . Wherein, several protective rings 110 may be of the same size or different sizes. Different protection rings have the same outer diameter and shape, and the inner diameter is the inner diameter of the area to be shielded on the substrate. Exemplary, continue to refer to Figure 6 , the protection ring library 220 includes several layers, and each layer is a ring setting space.

[0076] Figure 7 is the internal structure diagram of the guard r...

Embodiment 3

[0080] Embodiment 3 of the present invention provides a lithography equipment, Figure 8 is a partial structural schematic diagram of the lithography equipment in Embodiment 2 of the present invention, as Figure 8 As shown, the lithographic equipment includes the guard ring library unit 200 as described in the second embodiment of the present invention;

[0081] It also includes an exposure table unit 300, a protective ring grabbing unit 400, and a manipulator unit 500;

[0082] The exposure table unit 300 is located on the workpiece table 301 of the lithography equipment, and is used to carry and hold the substrate edge protection ring unit 100 and the substrate;

[0083] The protective ring grabbing unit 400 is arranged opposite to the workpiece table 301, and is used to grab or release the protective ring 110;

[0084] The manipulator unit 500 is used to complete the transfer of the substrate edge guard ring unit 100 between the guard ring library unit 200 and the exposu...

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PUM

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Abstract

The invention discloses a substrate edge protection ring unit, photoetching equipment and a protection method. The substrate edge protection ring unit comprises a protection ring and a protection ringtray, wherein a first fixing part is arranged on the protection ring, and a second fixing part corresponding to the first fixing part is arranged on the protection ring tray. When the protection ringis arranged on the protection ring tray, the first fixing part is matched with the second fixing part to fix the protection ring on the protection ring tray. According to the substrate edge protection ring unit provided by the embodiment of the invention, the position of the protection ring is fixed, thereby avoiding the position deviation of the protection ring in the conveying process, guaranteeing that the protection ring grabbing unit can accurately grab the protection ring, and guaranteeing the ring placing precision. Meanwhile, due to the fact that position alignment does not need to beconducted manually, the ring releasing efficiency and the equipment yield are improved.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductor manufacturing, and in particular to a substrate edge protection ring unit, photolithography equipment and protection method. Background technique [0002] There are two methods of positive resist exposure and negative resist exposure in the substrate exposure process. In order to eliminate the yield problem caused by the pollution of the photoresist at the edge of the substrate to the subsequent process, it is often chosen to remove the photoresist at the edge of the substrate during the exposure process. For the positive resist, it can be realized by developing after the substrate edge exposure process, while for the negative resist, it is necessary to shield and protect the edge of the substrate during the exposure process, and it can be removed after development. [0003] In the prior art, a protective ring is used to cover the edge of the substrate, so as to protect the nega...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/708
Inventor 蔡晨王鑫鑫
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD