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Sputtering film-forming device

A film forming device and sputtering technology, which is applied in sputtering plating, ion implantation plating, metal material coating process, etc., can solve the problem that the rotation speed ratio of the substrate tray cannot be adjusted freely, and the vacuum side gear transmission is easy to generate dust. , can not meet the needs of high-quality coating and other problems, to achieve the effect of meeting high precision and low defects, reducing dust, and reducing the generation of substrate film defects

Pending Publication Date: 2019-11-05
OPTORUN SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the revolution structure of the gear transmission is usually a fixed transmission ratio, and it is impossible to freely adjust the revolution ratio of the substrate tray (workpiece disk)
Moreover, the substrate tray (workpiece tray) rotates at high speed, and the gear transmission on the vacuum side is prone to generate dust, which affects the appearance of film products and cannot meet the needs of high-quality coating

Method used

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  • Sputtering film-forming device
  • Sputtering film-forming device
  • Sputtering film-forming device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example 1: The sputtering method usually uses metal mode sputtering to prepare optical films. The preparation method is that when the substrate tray (workpiece disk) rotates to the sputtering unit, the substrate deposits the target material film, and when the substrate tray rotates to the reaction unit , the target material film deposited on the surface of the substrate reacts to form an optical film. Such as figure 1 As shown, the main body of the sputtering film forming apparatus in this embodiment is a vacuum film forming chamber 1, and its interior is used as a film forming space, including a substrate tray revolution turntable 2 and a substrate tray autorotation turntable 3, wherein the substrate tray is The turntable 2 can revolve in the vacuum film forming chamber 1 , and the substrate tray rotation turntable 3 is connected below the substrate tray revolution turntable 2 and can rotate in the vacuum film forming chamber 1 . Substrates 4 placed horizontally are r...

Embodiment 2

[0023] Embodiment two: if figure 2 As shown, the difference between this embodiment and the first embodiment is that a multi-stage sub-turntable structure is provided under the substrate tray autorotation turntable 3, and the multi-stage sub-turntable structure includes a plurality of sub-turntables 12. The number of turntables 12 can be selected according to the actual situation, but generally the sub-turntables 12 are symmetrically arranged around the rotation axis of the substrate tray rotation turntable 3 to ensure the uniformity of film thickness. The sub-turntable 12 is connected with a non-contact magnetic transmission part 11, the non-contact magnetic transmission part 11 can be adapted to the rotation shaft of the substrate tray autorotation turntable 3, and its function is to transmit the rotation of the rotation shaft of the substrate tray autorotation turntable 3 to the sub-turntable 12, so that each independent sub-turntable 3 can rotate independently under the s...

Embodiment 3

[0024] Embodiment three: as image 3 As shown, the difference between this embodiment and the first embodiment is that the vertically arranged substrate 4 is loaded under the substrate tray autorotation turntable 3, and the substrate 4 is arranged in the vacuum film forming chamber 1. The positions of sputtering unit 5 and reaction unit 6 are adapted. In combination with Embodiment 1, different loading modes can be selected according to different substrate sizes to meet the film-forming requirements of different substrates.

[0025] At the same time, another difference between this embodiment and the first embodiment is that the revolution motor 7 transmits its power to the rotating shaft of the substrate tray revolution turntable 2 through the transmission mechanism 14, so that the revolution motor 7 can be adjusted later. Carry out maintenance.

[0026] When the above-mentioned embodiment is actually implemented: the conductive slip ring 8 may be composed of rotating elect...

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Abstract

The invention relates to the technical field of film preparation, in particular to a sputtering film-forming device which is characterized in that a substrate tray revolution turntable is in drive connection with a revolution motor arranged outside a vacuum film forming chamber and is driven by the revolution motor to rotate; a substrate tray autorotation turntable is in drive connection with an autorotation vacuum motor arranged in the vacuum film forming chamber; the autorotation vacuum motor is connected with a conductive sliding ring arranged outside the vacuum film forming chamber througha vacuum lead-in electrode; and the substrate tray autorotation turntable rotates under the driven of the autorotation vacuum motor. The sputtering film-forming device has the advantages that adjustment of a rotating speed ratio of revolution and autorotation of a substrate tray is realized, the uniformities of film thicknesses of different coating materials depositing on a substrate can be remarkably improved, and the preparation requirements of the film with high precision and low defects can be met; and dust generated by friction vibration of a transmission gear group when the transmissiongear group is adopted is reduced, so that generation of the defects of the substrate film is reduced.

Description

technical field [0001] The invention relates to the technical field of thin film preparation, in particular to a sputtering film forming device. Background technique [0002] Optical thin film usually refers to one or more layers of dielectric film or metal film, or a mixed film layer composed of dielectric film and metal film, plated on the optical element (substrate). Optical films can reduce or increase light reflection, beam splitting, color separation, light filtering, polarization, etc. [0003] There are two commonly used methods for preparing optical thin films, one is sputtering and the other is evaporation. In the sputtering method, ions are usually used to bombard the surface of the target, and the atoms of the target are bombarded out and deposited on the surface of the substrate to form a film. In the evaporation method, electron beam or thermal evaporation is usually used to deposit an optical film on the surface of the substrate. [0004] The conventional f...

Claims

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Application Information

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IPC IPC(8): C23C14/50C23C14/34C23C14/54
CPCC23C14/505C23C14/34C23C14/542
Inventor 余龙张詠麟马淑莹裴蓓
Owner OPTORUN SHANGHAI CO LTD
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