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Method of preparing PCB with improvement on back hole drilling burrs and small crimping hole

A crimping hole and back-drilling technology, which is applied in multi-layer circuit manufacturing, printed circuit manufacturing, and the formation of electrical connection of printed components, can solve problems such as small crimping holes and achieve the effect of preventing small crimping holes.

Active Publication Date: 2019-11-08
珠海崇达电路技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems that the printed circuit boards with back-drilled holes are produced through the existing positive or negative process, and there are holes on the board or small defects in the crimping holes on the board, and provides a method that can improve the back-drilled holes And a PCB preparation method for improving the problem of small crimping holes

Method used

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Embodiment

[0019] This embodiment provides a PCB preparation method for improving back-drilled holes and small crimping holes, which includes the following steps: specifically, the following steps are included:

[0020] (1) Cutting: Cut out the double-sided copper clad laminate as the inner core board according to the panel size required by the design.

[0021] (2) Making the inner layer circuit: the inner layer circuit is made on the inner layer core board by adopting the negative process, and the inner layer core board with the inner layer circuit prepared is obtained. Carry out POE punching and inner layer AOI sequentially according to conventional procedures.

[0022] (3) Lamination: pre-press the inner core board, then pre-stack the inner core board, prepreg, and outer copper foil according to the product design, and perform pre-lamination by fusion and / or riveting. Fixing, the layers are pre-fixed together to form a pre-laminated structure, and then the pre-laminated structure is ...

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Abstract

The invention relates to the technical field of printed circuit boards, in particular to a method of preparing a PCB with improvement on back hole drilling burrs and a small crimping hole. The production design requirements are met by one-time electroplating to the thickness of the hole copper during the whole plate electroplating, a pattern electroplating process in a positive film process is correspondingly changed, only tin plating rather than copper plating is performed at a window opening, over thick hole copper in a crimping hole (part of a second through hole) by electroplating in the case of pattern electroplating can thus be avoided, the crimping hole copper thickness is not affected by the pattern electroplating process, and the hidden danger that over thick hole copper in the crimping hole to result in a small crimping hole can be effectively prevented. Besides, etching processing is carried out after back drilling, the aperture burrs formed at the aperture in the case of back drilling can be removed, and thus, through the method disclosed in the invention, the problems of the aperture burrs of the back drilling hole and the problem of a small crimping hole can be improved at the same time.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a PCB preparation method for improving back-drilled holes and small crimping holes. Background technique [0002] For resin-plugged printed circuit boards with back-drilled holes, the resin holes and vias (including those used to make back-drilled and crimped holes) are usually drilled at one time in the outer layer drilling process and then plated at the same time , complete the etching and remaining processes through the positive film process or the negative film process. The process of negative film process is usually: lamination→outer layer drilling→outer layer copper sinking→full plate plating→resin plug hole→abrasive belt grinding plate→outer layer graphics→outer layer etching→outer layer AOI→solder mask→characters→ Surface treatment→back drilling→forming→electrical testing→FQC→FQA→packaging. The process of the positive film process is usually: lamination→o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/46
CPCH05K3/0047H05K3/423H05K3/4611
Inventor 李永妮孙保玉彭卫红宋建远
Owner 珠海崇达电路技术有限公司
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