Clean room

Abstract

The invention relates to the technical field of clean plants, and discloses a clean room. The clean room includes a pressure regulating equipment assembly, and the pressure regulating equipment assembly is used for regulating air pressure in a double wall sandwich channel of an upper technical interlayer to make the air pressure in the double wall sandwich channel of the upper technical interlayerhigher than air pressure in an adjacent upper technical interlayer with a pollution source and an adjacent upper technical interlayer without the pollution source when the clean room is in normal production; and/or the pressure regulating equipment assembly is used for regulating air pressure in a double wall sandwich channel of a lower technical interlayer to make the air pressure in the doublewall sandwich channel of the lower technical interlayer higher than that in an adjacent lower technical interlayer with the pollution source and an adjacent lower technical interlayer without the pollution source when the clean room is in normal production, or, make the air pressure in the double wall sandwich channel of the lower technical interlayer less than that in the adjacent lower technicalinterlayer with the pollution source and the adjacent lower technical interlayer without the pollution source when the clean room is in normal production. According to the disclosed clean room, pollutants generated by a production area with the pollution source entering a production area without the pollution source can be lowered or avoided to increase the yield of products in the production area without the pollution source.

Description

technical field [0001] The present application relates to the technical field of clean workshops, in particular to a clean room. Background technique [0002] As the mainstream products of the electronics industry, semiconductor ICs and display device TFT-LCD processes, demand for high standards continues to increase, in order to ensure the product qualification rate, the air quality requirements for clean rooms are getting higher and higher; The production process process will have certain adverse effects and affect the product yield. [0003] For example: the Array Photo in the array exposure area of ​​the TFT-LCD production plant, the glue coating and baking process in the CF Photo area in the color film exposure area, the organic waste gas generated during the organic solvent cleaning process in the PI area of ​​the alignment film, PI coating, baking, and PI heavy industry production process The exhaust gas is connected to the roof zeolite turbine unit and the regenerat...

AI Technical Summary

Problems solved by technology

[0005] However, if figure 1 and figure 2 As shown, if the cleanliness level requirement of the VOC-sensitive area is lower than that of the VOC-producing area, the room with a higher cleanliness level should maintain a positive pressure difference of not less than 5Pa relative to the room with a lower cleanliness level. Cause VOC to spread to adjacent VOC sensitive areas, affecting its production environment and product yield

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