Preparation method of bionic adhesive material with end-expanded microstructure array
A microstructure array and adhesion technology, applied in the directions of microstructure technology, microstructure device, manufacturing microstructure device, etc., can solve the problem that the processing accuracy of the uniform end structure needs to be further improved, so as to improve the service life, reduce the production cost, The effect of reliable industrial production
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention is described below through specific embodiments shown in the accompanying drawings. It should be understood, however, that these descriptions are exemplary only and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.
[0028] Such as figure 1As shown, shown is a flow chart of a preparation method of an end-expanded microstructure array adhesion material of the present invention, and the specific steps are:
[0029] Step 1: Processing a via hole array on the metal sheet with a laser; the diameter of the via hole is not greater than 100 microns, and the center-to-center distance between two adjacent via holes is not greater than 100 microns; the thickness of the metal sheet i...
PUM
Property | Measurement | Unit |
---|---|---|
elastic modulus | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com