Preparation method of bionic adhesive material with end-expanded microstructure array

A microstructure array and adhesion technology, applied in the directions of microstructure technology, microstructure device, manufacturing microstructure device, etc., can solve the problem that the processing accuracy of the uniform end structure needs to be further improved, so as to improve the service life, reduce the production cost, The effect of reliable industrial production

Active Publication Date: 2019-11-22
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
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Problems solved by technology

[0007] Porous metals / metal oxides have good scalability in terms of scale and scale as templates, but current research shows that the uniformity of the pore structure and the processing precision of the end structures of such porous metals / metal oxides need to be further improved

Method used

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  • Preparation method of bionic adhesive material with end-expanded microstructure array
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  • Preparation method of bionic adhesive material with end-expanded microstructure array

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention is described below through specific embodiments shown in the accompanying drawings. It should be understood, however, that these descriptions are exemplary only and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.

[0028] Such as figure 1As shown, shown is a flow chart of a preparation method of an end-expanded microstructure array adhesion material of the present invention, and the specific steps are:

[0029] Step 1: Processing a via hole array on the metal sheet with a laser; the diameter of the via hole is not greater than 100 microns, and the center-to-center distance between two adjacent via holes is not greater than 100 microns; the thickness of the metal sheet i...

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Abstract

The invention discloses a preparation method of an end-expanded microstructure array adhesive material, which belongs to the field of preparation of adhesive materials, and comprises the following steps: 1) processing a through hole on a metal sheet; 2) modifying the morphology of the through hole by adopting an electrochemical method to prepare a mold through hole assembly; 3) filling a mold witha polymer, curing, and demolding to obtain the end-expanded microstructure array adhesive material. According to the invention, controllable modification of the through hole is carried out by electroplating, precise machining of complex geometry on a metal material is realized; compared with an existing non-metal mold, the service life of the mold can be greatly prolonged, the production cost canbe greatly reduced, the tail end morphology of the microstructure can be regulated and controlled by adjusting the positive pressure between the through hole assembly and the substrate assembly according to the substrate assemblies with different elasticity moduli, and therefore preparation of adhesion materials with different properties is achieved.

Description

technical field [0001] The invention relates to a preparation method of an adhesive material, in particular to a preparation method of an adhesive material with a terminal expanded microstructure array. Background technique [0002] Many organisms in nature exhibit remarkable adhesion abilities on vertical surfaces and even ceilings. For example, moth larvae, some beetles, flies, bees, spiders, geckos, etc., this so-called "dry adhesion" ability is due to the microstructure of the bottom of their feet. Inspired by this biological function, scholars have carried out studies on fiber ends of various geometric shapes (such as flat, spherical, concave or enlarged ends, etc.) (see Del Campo A, Greiner C, álvarez I, et al. Patterned Surfaces with Pillars with Controlled 3D Tip Geometry Mimicking Bioattachment Devices.Advanced Materials, 2007,19(15):1973-1977), combined with a variety of preparation methods, prepared a variety of biomimetic structural materials with dry adhesion p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
CPCB81C1/00261B81C1/00301B29C33/3842B29C33/424B81B2203/0361B81C2201/034B81C1/00206B81B2207/056C25D3/12C25D1/10B29C2045/0094B29L2031/729Y02E60/10B29K2083/00B29K2105/0097B81B1/008B81C1/00111B81C99/0085C09J109/00C09J133/08C09J183/04C25D7/00
Inventor 戴振东姬科举袁聪唐义强陈健崔恩华
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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