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Metallographic section of ceramic electronic component and preparation method thereof

A technology for ceramic electronic components and metallographic slicing, which is used in the preparation of test samples, instruments, sampling, etc. strong effect

Active Publication Date: 2022-05-17
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional ceramic electronic components cannot provide the above information to inspectors during the grinding process, resulting in poor quality and low efficiency of inspection analysis

Method used

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  • Metallographic section of ceramic electronic component and preparation method thereof
  • Metallographic section of ceramic electronic component and preparation method thereof
  • Metallographic section of ceramic electronic component and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043]An embodiment of the metallographic slice of the ceramic electronic component described in the present invention, the preparation method of the metallographic slice of the ceramic electronic component described in this embodiment is as follows:

[0044] The nickel metal slurry is printed on the ceramic film by using a silk screen, and the ceramic film with the metal layer is obtained after drying. The ceramic material in the ceramic membrane is barium titanate, and the thickness of the metal layer is 1 μm. A ceramic membrane with a metal layer and a plurality of ceramic membranes are stacked and pressed together by isostatic pressing to obtain a substrate. The thickness of the substrate was 0.3 mm. The metal layer is located inside the substrate, and the distance from the metal layer to the two surfaces of the substrate perpendicular to the stacking direction is equal. The substrate is cut vertically and horizontally according to the cutting line to obtain a plurality ...

Embodiment 2

[0046] An embodiment of the metallographic slice of the ceramic electronic component described in the present invention, the preparation method of the metallographic slice of the ceramic electronic component described in this embodiment is as follows:

[0047] The copper metal paste is printed on the ceramic film by using a silk screen, and the ceramic film with the metal layer is obtained after drying. The ceramic material in the ceramic membrane is calcium zirconate. The thickness of the metal layer is 3 μm. A ceramic membrane with a metal layer and a plurality of ceramic membranes are stacked and pressed together by isostatic pressing to obtain a substrate. The thickness of the substrate was 2 mm. The metal layer is located inside the substrate, and the distance from the metal layer to the two surfaces of the substrate perpendicular to the stacking direction is equal. The substrate is cut vertically and horizontally according to the cutting line to obtain a plurality of ...

Embodiment 3

[0049] An embodiment of the metallographic slice of the ceramic electronic component described in the present invention, the preparation method of the metallographic slice of the ceramic electronic component described in this embodiment is as follows:

[0050] The tungsten metal paste is printed on the ceramic film by using a silk screen, and the ceramic film with the metal layer is obtained after drying. The ceramic material in the ceramic membrane is alumina. The thickness of the metal layer is 2 μm. A ceramic membrane with a metal layer and a plurality of ceramic membranes are stacked and pressed together by isostatic pressing to obtain a substrate. The thickness of the substrate was 1 mm. The metal layer is located inside the substrate, and the distance from the metal layer to the two surfaces of the substrate perpendicular to the stacking direction is equal. The substrate is cut vertically and horizontally according to the cutting line to obtain multiple cuboid identif...

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Abstract

The invention discloses a method for preparing metallographic slices of ceramic electronic components, comprising the following steps: (1) printing metal paste on a ceramic film by screen printing, and drying to obtain a ceramic film with a metal layer ; (2) laminating and pressing a ceramic membrane with a metal layer and multiple ceramic membranes to obtain a substrate; (3) cutting the substrate to obtain an identification block with a metal layer; (4) combining the identification block and the ceramic to be inspected The electronic components are placed side by side in the same mold, and then the colloid is poured into it to obtain a rubber block after the colloid is cured; (5) Grinding and polishing the rubber block. The invention can provide the inspector with position information during the grinding process, so that the inspector can know the grinding depth of the current section and the specific position of the current section in the ceramic electronic component, and can improve the quality and efficiency of the metallographic section inspection and analysis of the ceramic electronic component. Simple and easy to implement, strong applicability.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a metallographic slice of a ceramic electronic component and a preparation method thereof. Background technique [0002] Usually, when performing metallographic section inspection and analysis on ceramic electronic components or their semi-finished products such as sintered ceramic bodies, the samples to be inspected are arranged in a mold and filled with resin to make a resin block, and then the samples fixed in the resin block are ground, After polishing, the resin block is finally placed under a microscope to observe the sample. Sometimes the inspector needs to know the specific position of the current profile in the sample and the grinding depth of the current profile. For example, when an internal defect is found in the sample, he wants to know the specific position and approximate size of the defect in the sample, so as to analyze the nature and cause of the defect ; O...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/06G01N1/28G01N1/32G01B11/22G01B11/00
CPCG01N1/06G01N1/286G01N1/32G01B11/22G01B11/00G01N2001/2866
Inventor 陆亨张毅刘伟峰田述仁安可荣
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG