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Symmetrical multi-line transient tropical solid high-heat-conductivity-coefficient testing device

A technology with high thermal conductivity and high thermal conductivity, applied in the direction of thermal development of materials, can solve the problems of poor test repeatability, multi-user, low signal-to-noise ratio, etc., and achieve the effect of reducing production cost and improving thermal diffusivity.

Inactive Publication Date: 2019-11-26
北京西摩斯计量设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Transient hot zone method, hot wire method and planar heat source method have poor test repeatability due to low signal-to-noise ratio in the test process. This problem is especially prominent in the aspect of large thermal conductivity. In the process of testing materials with large thermal conductivity, the improvement of accuracy is obtained according to the square root of the number of measurements, because the higher the thermal conductivity of the material, the more tests need to be performed, which may be unbearable to the user

Method used

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  • Symmetrical multi-line transient tropical solid high-heat-conductivity-coefficient testing device
  • Symmetrical multi-line transient tropical solid high-heat-conductivity-coefficient testing device
  • Symmetrical multi-line transient tropical solid high-heat-conductivity-coefficient testing device

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Embodiment

[0039] refer to figure 1 The structural diagram of the heating chip of the present invention shown, figure 2 and image 3 gives figure 1 The schematic diagram of the enlarged structure of the local area E-E and the local area F-F and the size of the heating wire are marked in the figure, and the unit in the figure is mm.

[0040] A power supply is used to provide constant energy for the two opposite nodes of the heating plate; wherein, the power supply can be a constant current source, a constant voltage source, or a constant power source;

[0041] The data acquisition system is used to collect the voltage and temperature changes of the other two relative nodes after the same material to be tested is attached to the upper and lower surfaces of the heating plate, and obtain the thermal conductivity of the material to be tested.

[0042] In a specific implementation process, the pitch of each metal line constituting the hot zone is 0.1 mm, and the minimum width of the metal ...

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Abstract

The invention relates to the technical field of material heat conductivity coefficient testing, in particular to a device for measuring the heat conductivity coefficient and the thermal diffusion coefficient of a high-heat-conductivity-coefficient solid material. The invention discloses a device for measuring the heat conductivity coefficient and the thermal diffusion coefficient of a large-heat-conductivity-coefficient solid material of a symmetrical multi-wire transient hot-belt heating film, and the device comprises a heating piece which consists of eight heating resistors and consists of multiple wires, a power supply, and a data collection system. The problems that an existing steady-state heat conductivity coefficient testing technology is too long in testing time, an existing transient-state heat conductivity coefficient testing technology is not high in signal-to-noise ratio due to model limitation, and repeatability is poor in the testing process, especially in the testing process of a high-heat-conductivity-coefficient material are solved.

Description

technical field [0001] The invention relates to the technical field of testing material thermal conductivity, in particular to a measuring device for thermal conductivity and thermal diffusivity of solid materials with high thermal conductivity. Background technique [0002] As important physical parameters of matter, material thermal conductivity and thermal diffusivity have important uses in the fields of chemical engineering, materials, energy, power and refrigeration engineering, and are essential basic data in many industrial processes and product designs. With the rapid development of modern industry, the measurement of thermal conductivity and thermal diffusivity of solid materials has been paid more and more attention by people. [0003] The thermal conductivity and thermal diffusivity of substances can be obtained through experimental measurement, theoretical calculation or computer simulation, but at present, experimental measurement is still the main method. Ac...

Claims

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Application Information

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IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 孙毅时建捷郭清华
Owner 北京西摩斯计量设备有限公司
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