Fluoride-free low-temperature corrosive agent and preparation method
A etchant and low temperature technology, applied in the field of fluorine-free low temperature etchant and preparation, can solve the problems of high energy consumption, large environmental pollution and high cost, and achieve the effects of low energy consumption, good corrosion effect and low cost
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Embodiment 1
[0025] A fluorine-free low-temperature etchant, including a cleaning agent and an etching agent, the cleaning agent is obtained in the following weight percentages: 5% sulfuric acid, 1% oxidant, 1% surfactant, and 93% deionized water; the etching agent is obtained in the following weight percentages : Strong oxidant solution 1%, sulfuric acid 5%, deionized water 94%.
Embodiment 2
[0027] A fluorine-free low-temperature etchant, including a cleaning agent and an etchant; the cleaning agent is obtained in the following weight percentages: 30% of sulfuric acid, 10% of ferric salt, 10% of a low-temperature amphoteric surfactant, and 50% of deionized water; the etchant , obtained by using the following weight percentages: 3% hydrogen peroxide solution, 7% sulfuric acid, and 90% deionized water.
Embodiment 3
[0029] A fluorine-free low-temperature etchant, including cleaning agent and etchant. The cleaning agent is obtained in the following weight percentages: 40% of sulfuric acid, 20% of tetravalent vanadium salt, 15% of surfactant, and 25% of deionized water; the etching agent is obtained in the following weight percentages: 5% of sodium peroxide solution, 10% of sulfuric acid %, deionized water 85%.
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