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Preparing process for foamed metal used for electronic component heat dissipation system

A technology for electronic components and metal foam, which is applied in the field of metal foam preparation to achieve the effects of reducing pinholes and pitting, low cost and increasing current

Active Publication Date: 2019-11-29
TAICANG DOW ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent only improves the heat dissipation capacity by improving the structure of the heat dissipation system, and does not involve the materials used in the heat dissipation system

Method used

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  • Preparing process for foamed metal used for electronic component heat dissipation system

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Preparation of unmodified metal foam:

[0047] (1) Pretreatment of polyurethane: conducting conductive treatment of polyurethane with conductive glue method;

[0048] 1) Ultrasonic cleaning and degreasing: immerse the polyurethane in the degreasing liquid and place it in an ultrasonic machine for continuous cleaning for 10 minutes and press the polyurethane with a cleaning rod to fully remove the oil. The ultrasonic frequency is 28khz and then wash and dry with pure water ;

[0049] 2) Coarsening: immerse the above-mentioned polyurethane in the roughening solution in clear water for roughening treatment, and the roughening time is 1 min;

[0050] (3) Coating conductive adhesive: immerse the above-mentioned polyurethane into the conductive adhesive, and squeeze it repeatedly under ultrasonic conditions. After 2 minutes, take out the polyurethane and squeeze out the excess conductive adhesive until there is no hole blocked by the conductive adhesive. So far, after repea...

Embodiment 2

[0056] Preparation of modified metal foam:

[0057] (1) Pretreatment of polyurethane: conducting conductive treatment of polyurethane with conductive glue method;

[0058] (2) Conductive thread is set: evenly cloth conductive thread in the pretreated polyurethane matrix;

[0059] (3) pre-plating: a titanium basket is respectively placed as the positive pole on both sides of the plating tank, and nickel blocks of the same quality are placed in the titanium basket; the above-mentioned polyurethane is fixed in the center of the aqueduct, and after the electrodes are connected, the power supply is set to be a voltage regulator. Set the voltage to 4V; when nearly half of the polyurethane foam covers the upper nickel layer, adjust the voltage to 6V, and the current density is 2.5A / dm2; until the current is stable and the polyurethane surface is evenly covered with a layer of nickel layer, the pre-plating process is over ;

[0060] (4) Nickel electroplating: fill the plating soluti...

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Abstract

The invention relates to a preparing process for foamed metal used for an electronic component heat dissipation system. The preparing process includes the following steps of pretreatment of polyurethane, arrangement of conductive wires, pre-plating, nickel electroplating and modification of the foamed metal; as for pretreatment of the polyurethane, a conductive glue method is used for conducting electric conduction treatment on the polyurethane; and the conductive wires are evenly arranged on a polyurethane base obtained after pretreatment, and then preplating, nickel electroplating and modification of the foamed metal are carried out. The preparing process for the foamed metal used for the electronic component heat dissipation system is simple in process and high in flexibility. The conductive glue method is firstly used for conducting electric conduction treatment, the cost is low, and the process is simple; parameters such as the voltage, the current density, the plating liquid composition and the temperature are improved, and the smoothness and mechanical properties of the plating layer surface of the foamed metal are improved; and finally, the foamed metal is modified, the thermal conductivity of the materials is greatly improved, and the good development prospect is achieved.

Description

technical field [0001] The invention belongs to the technical field of new materials, and in particular relates to a preparation process of metal foam used for heat dissipation systems of electronic components. Background technique [0002] With the development of industrial informatization in modern society, the trend of automation and intelligence is becoming more and more apparent. Whether it is public service, people's livelihood, medical education or even the military, there are higher requirements for the further development of electronic technology. [0003] Modern electronic components consume more and more power, and these changes bring about more heating effects. This poses a lot of challenges to the power improvement and safety issues of electronic components. The heat dissipation capability is one of the bottlenecks in the power consumption and safety of components. Enhancing the heat dissipation capability is of great significance to the improvement of the per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54C25D5/20C25D3/12
CPCC25D3/12C25D5/20C25D5/54
Inventor 陶振宇
Owner TAICANG DOW ELECTRIC