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Packaging structure

A technology of encapsulation structure and contact structure, applied in electrical components, electrical solid devices, circuits, etc., can solve the problem that the electromagnetic shielding effect needs to be improved, and achieve the effect of improving the effect and ensuring the integrity.

Active Publication Date: 2019-12-03
NANTONG TONGFU MICROELECTRONICS CO LTD
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Problems solved by technology

[0004] An existing electromagnetic shielding solution is mainly to set a magnetic field shielding layer on the semiconductor packaging structure to shield the electromagnetic interference between chips, but the effect of the existing electromagnetic shielding still needs to be improved

Method used

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Embodiment Construction

[0027] As mentioned in the background, the effect of existing electromagnetic shielding still needs to be improved.

[0028] The study found that the existing magnetic field shielding layer is generally formed by sputtering process. Since the thickness of the semiconductor package structure is generally thick, and the semiconductor package structure is generally rectangular, the semiconductor package structure has multiple corners and the side wall is relatively steep. When the magnetic field shielding layer covering the semiconductor package structure is formed by sputtering, the thickness of the formed magnetic field shielding layer is likely to be uneven, and the edge of the semiconductor package structure may not be covered, thus making it difficult to guarantee the shielding effect of the magnetic field shielding layer.

[0029] To this end, the present invention provides a packaging structure and its forming method. After the functional surfaces of several semiconductor c...

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Abstract

A packaging structure comprises a pre-sealing panel, the pre-sealing panel comprises a plastic packaging layer, a plurality of semiconductor chips are arranged in the plastic packaging layer, each semiconductor chip comprises a functional surface and a non-functional surface opposite to the functional surface, the functional surface is provided with a plurality of bonding pads, and the plastic packaging layer exposes the plurality of bonding pads on the functional surface; and a first shielding layer and a second shielding layer are positioned between the semiconductor chip and the plastic packaging layer, wherein the first shielding layer wraps the non-functional surface and the side wall surface of the semiconductor chip, and the second shielding layer is located between the first shielding layer and the plastic packaging layer and completely covers the non-functional surface and the first shielding layer surface on the side wall of the semiconductor chip. Through the second shielding layer on the first shielding layer, the second shielding layer can cover places with uneven thickness and poor edge coverage in the first shielding layer, so that the whole shielding layer formed bythe first shielding layer and the second shielding layer is complete, and the shielding effect is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a packaging structure with electromagnetic shielding. Background technique [0002] The rapid development of a new generation of electronic products has promoted the development of integrated circuit packaging in the direction of high density, high frequency, miniaturization, and high integration, and high-frequency chips often generate strong electromagnetic waves, which cause undesirable effects on the inside and outside of the package and the chip. In addition, the density of electronic components is getting higher and higher, and the distance of transmission lines is getting closer and closer, which makes the problem of electromagnetic interference from inside and outside the integrated circuit package more and more serious, and at the same time will reduce the quality and life of integrated circuits. [0003] In electronic equipment and electronic products, electro...

Claims

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Application Information

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IPC IPC(8): H01L23/552
CPCH01L23/552H01L2924/3025H01L2224/96H01L2224/04105H01L2224/12105
Inventor 陶玉娟
Owner NANTONG TONGFU MICROELECTRONICS CO LTD
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