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Method for preparing nano-twinned copper layer by high-frequency pulse

A technology of nano-twinned copper and high-frequency pulses, applied in the preparation of nano-twinned copper layers, using high-frequency pulses to prepare nano-twinned copper layers, can solve the problem of slow deposition speed, low production efficiency, and maintenance costs of electroforming solutions High-level problems, to achieve fast deposition speed, improve production efficiency, reduce costs and the effect on the environment

Active Publication Date: 2021-08-03
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a longer pulse off time (usually 1 to 4s, pulse frequency range of 0.25 to 1Hz) leads to a slower deposition rate, which reduces the production efficiency of the nano-twinned copper layer to a certain extent.
[0004] To sum up, there are still problems such as slow deposition speed, low production efficiency, and high maintenance cost of electroforming solution for the preparation of twinned copper layers by electroforming, which is not conducive to the large-scale production of nano-twinned copper layers.

Method used

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  • Method for preparing nano-twinned copper layer by high-frequency pulse
  • Method for preparing nano-twinned copper layer by high-frequency pulse
  • Method for preparing nano-twinned copper layer by high-frequency pulse

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Step 1: Prepare electroforming copper solution

[0028] Step 101: Add about 700mL of deionized water into a 1L electroforming tank;

[0029] Step 102: Add 25g copper sulfate pentahydrate (CuSO 4 ·5H 2 O) and 100mL volume fraction of 98% sulfuric acid (H 2 SO 4 ), uniformly stirred to obtain an electroforming copper solution; and adding deionized water to the electroforming copper solution until the total volume of the electroforming copper solution was 1L;

[0030] Step 2: Electroforming nano-twinned copper layer

[0031] Step 201: adjusting the temperature of the electroforming copper solution to 30° C., and keeping it constant during the electroforming process;

[0032] Step 202: Place a copper electroforming anode with a purity of 99.98% and a titanium metal cathode to be electroformed with a bright surface in the electroforming solution, adjust the distance between the cathode and the anode to 6 cm, and control the ratio of the areas of the cathode and the anod...

Embodiment 2

[0037] Step 1: Prepare electroforming copper solution

[0038] Step 101: Add about 1500 mL of deionized water into a 2L electroforming tank;

[0039] Step 102: Add 30g copper sulfate pentahydrate (CuSO 4 ·5H 2 O) and 200mL volume fraction of 98% sulfuric acid (H 2 SO 4 ), uniformly stirred to obtain an electroforming copper solution; and adding deionized water to the electroforming copper solution until the total volume of the electroforming copper solution was 2L;

[0040] Step 2: Electroforming nano-twinned copper layer

[0041]Step 201: adjusting the temperature of the electroforming copper solution to 35° C., and keeping it constant during the electroforming process;

[0042] Step 202: Place a copper electroforming anode with a purity of 99.98% and a bright titanium metal cathode to be electroformed in the electroforming solution, adjust the distance between the cathode and the anode to 3 cm, and control the ratio of the areas of the cathode and the anode to 1:5;

[...

Embodiment 3

[0047] Step 1: Prepare electroforming copper solution

[0048] Step 101: Add about 700mL of deionized water into a 1L electroforming tank;

[0049] Step 102: Add 30g copper sulfate pentahydrate (CuSO 4 ·5H 2 O) and 100mL volume fraction of 98% sulfuric acid (H 2 SO 4 ), uniformly stirred to obtain an electroforming copper solution; and adding deionized water to the electroforming copper solution until the total volume of the electroforming copper solution was 1L;

[0050] Step 2: Electroforming nano-twinned copper layer

[0051] Step 201: adjusting the temperature of the electroforming copper solution to 20° C., and keeping it constant during the electroforming process;

[0052] Step 202: Place a copper electroforming anode with a purity of 99.98% and an ABS plastic cathode coated with conductive silver paint to be electroformed in the electroforming solution, adjust the distance between the cathode and the anode to be 8 cm, and control the ratio of the area of ​​the cath...

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Abstract

The invention discloses a method for preparing a nano-twinned copper layer by using high-frequency pulses. The method utilizes a high-frequency pulse electroforming technique to prepare columnar nano-twinned copper in an additive-free, low-concentration copper sulfate electroforming solution. The nano-twinned copper layer prepared by the present invention guarantees high mechanical properties, and at the same time, the deposition speed of the cast copper layer is faster, the concentration of copper sulfate used is low, and no additives are added, the maintenance cost of the electroforming solution is greatly reduced, and the The impact of the electroforming process on the environment is conducive to the large-scale preparation of nano-twinned copper layers.

Description

technical field [0001] The invention relates to the technical field of nanostructured metal materials, and relates to a method for preparing a nano-twinned copper layer, in particular to a method for preparing a nano-twinned copper layer by using high-frequency pulses. Background technique [0002] Copper metal materials play a pivotal role in modern science and manufacturing fields, which is due to the excellent electrical and thermal conductivity of copper metal itself (second only to silver metal in pure metals). Whether it is advanced electronic interconnection, computer industry, communication technology and other high-tech products, copper materials are inseparable. At the same time, the performance requirements for copper materials are constantly increasing. In recent years, nano-twinned copper layers have attracted the attention of researchers because of their excellent mechanical properties, high electrical conductivity, and thermal stability. As the research on n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D3/38
CPCC25D1/006C25D1/04C25D3/38
Inventor 张新平詹晓非
Owner NANJING UNIV OF SCI & TECH
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