3results about "Electroforming nanostructures" patented technology

The invention relates to a method of providing a plurality of nanowires (14) on a surface (15), comprising: a) providing an electrolyte dispenser (1); b) providing a foil (16) having a plurality of continuous holes (17); c) arranging the foil (16) between the surface (15) and an outlet side (4) of the electrolyte dispenser (1); d) introducing a liquid electrolyte into the electrolyte dispenser (1) such that the liquid electrolyte is deposited onto the foil (16) at the outlet side (4) of the electrolyte dispenser (1); and e) applying a voltage between the liquid electrolyte and the surface (15) such that the nanowires (14) grow from the liquid electrolyte in the holes (17) of the foil (16) onto the surface (15).

A method of electroplating nanograined copper on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; and electroplating the substrate in the electroplating bath to form the nanograined copper at room temperature. The suppressor is a ployether polyol compound, the nanograined copper has an average grain size of about 100 nm, and the nanograined copper has a resistivity of about 1.78-1.90 μOhm·cm. A nanograined copper prepared according to the method is also disclosed.

Method for producing a plurality of nanowires (1) on an electrically conductive surface (2), comprising: a) applying a masking layer (3) to the surface (2), wherein the masking layer (3) has multiple recesses (4) in which the surface (2) is uncovered by the masking layer (3), b) applying a respective foil piece (5) to the surface (2) in each of the recesses (4), wherein the foil pieces (5) each have a plurality of pores (6) extending continuously over a thickness (dF) of the respective foil piece (5), c) growing the nanowires (1) onto the surface (2) into the pores (6) of the foil pieces (5).