Tin-plated copper terminal material, terminal and wire end structure

Abstract

The present invention provides a tinned copper terminal material, a terminal made of the terminal material, and an electric wire end structure using the terminal. The tinned copper terminal material has: a base material, which is made of copper or a copper alloy; an intermediate zinc layer, formed on the base material and composed of a zinc alloy, and having a thickness of 0.10 μm or more and 5.00 μm or less; and a tin layer formed on the intermediate zinc layer and composed of tin or a tin alloy, and having a small-tilt grain boundary length The tin-plated copper terminal material effectively suppresses galvanic corrosion when the ratio to the total grain boundary length is 2% or more and 30% or less.

Description

technical field [0001] The present invention relates to a tin-plated copper terminal material, a terminal made of the terminal material, and an electric wire terminal structure using the terminal. [0002] This application claims priority based on Japanese Patent Application No. 2017-096979 filed on May 16, 2017, and uses the content thereof here. Background technique [0003] Conventionally, the lead wire is connected to the other device by connecting the terminal crimped to the terminal portion of the lead wire to a terminal provided on the other device. Lead wires and terminals are generally formed of highly conductive copper or copper alloys, but lead wires made of aluminum or aluminum alloys are also used for weight reduction and the like. [0004] For example, Patent Document 1 discloses an electric wire with a terminal in which a terminal made of copper (copper alloy) on which a tin-plated layer is formed is crimped to a lead wire made of aluminum or an aluminum allo...

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Problems solved by technology

[0012] As in Patent Document 1, when the base of the tin layer is provided with an anti-corrosion layer made of zinc or zinc alloy, there is a problem that the anti-corrosion layer and the Sn-plated layer are caused by Sn substitution when the Sn plating process is carried out on the anti-corrosion layer. problems such as poor adhesion

[0013] As shown in Patent Document 2, when a Sn-containing 3 o 2 (OH) 2 In the case of a conductive film layer of (oxyhydroxide), there is a problem of low durability because the conductive film layer is rapidly damaged when exposed to a corrosive environment or a heating environment.

Furthermore, as shown in Patent Document 3, regarding a Sn-Zn alloy (surface Sn plating layer) laminated on a Sn-Cu-based alloy layer (intermediate Sn-Cu plating layer) and a Zn high-concentration layer on the outermost layer, Sn plating material, there is a problem that the productivity of the Sn-Zn alloy layer is poor and the corrosion protection effect on the aluminum wire disappears when the copper of the Sn-Cu alloy layer is exposed on the surface.

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