Ceramic laser perforating device

A laser drilling and laser cutting technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of hole taper and roundness effects
CN110605488APending Publication Date: 2019-12-24DONGGUAN INST OF OPTO ELECTRONICS PEKING UNIV
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
DONGGUAN INST OF OPTO ELECTRONICS PEKING UNIV
Publication Date
2019-12-24

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Abstract

The invention relates to the technical field of laser processing equipment, in particular to a laser perforating device. The laser perforating device comprises a laser cutting portion, a control device and a workbench, and further comprises an X-axis movement mechanism, a Y-axis movement mechanism, a workbench and a rotary vibration mechanism. The rotary vibration mechanism is provided with an accommodating portion, when a ceramic material is cut, the ceramic material to be processed is placed in the accommodating portion, the control device controls the X-axis movement mechanism and the Y-axis movement mechanism to move, the coordinates of the center of the site of a hole perforated in the ceramic material to be processed are positioned, then the control device controls the rotary vibration mechanism to carry out rotary vibration to draw a circle, and the control device controls the laser cutting portion to emit a laser beam to complete perforation of the ceramic material to be process. By arrangement of the rotary vibration mechanism, for perforation of a through hole with the aperture greater than 0.07 mm, the perforation quality can be improved by a circle-drawing cutting mode,and the perforation efficiency is high.
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Description

technical field

[0001] The invention relates to laser processing equipment, in particular to a ceramic laser drilling device. Background technique

[0002] Ceramic materials such as alumina and aluminum nitride have the advantages of high thermal conductivity, high insulation and high temperature resistance, and are widely used in the fields of electronics and semiconductors. However, ceramic materials have high hardness and brittleness, and their forming and processing are very difficult, especially the processing of micropores. Due to the high power density and good directionality of the laser, lasers are generally used to drill holes in ceramic plates. Laser ceramic drilling generally uses pulsed lasers or quasi-continuous lasers. The laser beam is focused on the laser axis through the optical system. placed on the workpiece, emitting a high energy density (10 5 -10 9 W / cm 2 ) laser beam melts and vaporizes the material, and an airflow coaxial with the beam is ejected...

Claims

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