Device for providing instantaneous pressure and integrating cutting and grinding on basis of reciprocating motion

Abstract

The invention relates to the technical field of integrated circuits, and discloses a device for providing instantaneous pressure and integrating cutting and grinding on the basis of reciprocating motion. The device comprises a bottom plate, the entire device is supported by the bottom plate, through the cooperative use among a cutting knife, a grinding rod and a bearing frame, when the cutting knife cuts a plate, the plates are overlapped above a support frame under the gravity action, finally, the grinding rod is driven to move, so that the whole device can carry out cutting and grinding integrally, follow-up single grinding operations is omitted, the working efficiency during the whole integrated circuit manufacturing process is improved, through the cooperation among a vertical rod, a square block, a rotating rod, a connecting table and a push rod, the push rod moves forwards to drive the rotating rod to rotate, the vertical rod drives the square block to synchronously move downwards, and finally the cutting knife is driven to move downwards, and the downward force at the cutting moment is large and fast, so that cutting is more orderly compared with traditional up-down reciprocating cutting, and the generation of debris is reduced.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a device that provides instantaneous pressure based on reciprocating motion and integrates cutting and grinding. Background technique [0002] With the development of science and technology, people use their own wisdom to integrate semiconductors, resistors, capacitors and other components required by circuits with certain functions and the connecting wires between them on a small piece of silicon chip, and then package them in a small silicon chip by welding. In the shell, with the step-by-step exploration of scientists, it finally developed into today's integrated circuit, which has the advantages of small size and high performance, and is widely used in the production process of computers, mobile phones and other digital electrical appliances. Great changes in daily life. [0003] Integrated circuits mainly include lithography, etching, thin film, doping and chemi...

AI Technical Summary

Problems solved by technology

[0003] Integrated circuits mainly include lithography, etching, thin film, doping, and chemical mechanical planarization CMP, and are reused. Before lithography, the plate needs to be cut to cut it into a suitable shape suitable for the circuit board. Size, the traditional cutting plate needs to be ground separately after cutting, which makes the work efficiency low during operation, and the traditional cutting machine cuts by reciprocating motion, and the cutter cannot provide enough power when it moves down , it is impossible to complete the cutting of the plate at one time, more waste is generated, and the incision is less neat

[0004] In order to solve the above problems, the inventor proposed a device that provides instantaneous pressure based on reciprocating motion and integrates cutting and grinding, which has the advantages of integrating cutting and grinding, and solves the problem that the existing devices cannot combine cutting and grinding. The problem of low efficiency and uneven incision ensures that the staff can work more efficiently and make the incision more tidy when using the device.

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