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Flexible pressure sensor based on polyimide substrate microstructure and its preparation method

A pressure sensor, polyimide technology, applied in the direction of fluid pressure measurement, instrument, and measurement force by changing ohmic resistance, can solve the problems of complex process and structure, large size of pressure sensor, poor applicability, etc.

Active Publication Date: 2021-08-20
FUDAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, most pressure sensors based on carbon-based conductive particles doped with polymers have the disadvantages of large size, complex process and structure, and poor applicability.

Method used

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  • Flexible pressure sensor based on polyimide substrate microstructure and its preparation method
  • Flexible pressure sensor based on polyimide substrate microstructure and its preparation method
  • Flexible pressure sensor based on polyimide substrate microstructure and its preparation method

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0029] The invention provides a flexible pressure sensor based on the microstructure of the polyimide substrate. The pressure sensor has a film structure as a whole, and the whole body is made of flexible materials. Such as figure 1 As shown, the pressure sensor includes a lower flexible substrate 1, a force-sensitive structural layer 2 and an upper flexible packaging layer 3, and the three are closely attached. The force sensitive structure layer 2 includes a lower electrode layer 201 , a flexible piezoresistive material layer 202 and an upper electrode layer 203 . The sensor has the advantages of simple structure and easy array manufacturing. The preparation process is as follows:

[0030] (1) The polyimide solution was spin-coated on the silicon wafer, and the curing temperature and time were 120°C for 30 min, 180°C for 30 min and 250°C for 30 m...

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Abstract

The invention discloses a flexible pressure sensor based on a polyimide substrate microstructure and a preparation method thereof. The flexible pressure sensor of the present invention comprises a lower flexible substrate, a force-sensitive structural layer and an upper flexible encapsulation layer; the lower flexible substrate is a polyimide film, and its upper surface has a raised microstructure array; the force-sensitive structural layer and the lower flexible substrate The upper surface is tightly bonded, which includes a lower electrode layer, a flexible piezoresistive material layer, and an upper electrode layer from bottom to top. The flexible piezoresistive material layer is a carbon-based nanoparticle / polymer piezoresistive material with piezoresistive properties; the upper flexible package The layer is closely attached to the upper surface of the force-sensitive structure layer to protect the sensor and waterproof. The invention prepares a flexible pressure sensor based on a polyimide substrate microstructure by adopting bottom-up micro-nano manufacturing technology, and has the advantages of high sensitivity, ultra-thin and ultra-light, simple process, easy array manufacturing and strong applicability.

Description

technical field [0001] The invention belongs to the technical field of pressure measurement, and in particular relates to a flexible pressure sensor based on a polyimide substrate microstructure and a preparation method thereof. Background technique [0002] The skin plays a huge role in human life, and many tasks can be carried out with the help of the skin. However, for some amputee and burn patients who have lost part of the skin perception function, some high-risk and fine robotic arm workplaces, and patients with other health index signal monitoring, they need real-time feedback of external signals and personal health conditions, so the flexible pressure sensor is produced. and get developed. [0003] Flexible piezoresistive pressure sensors can easily convert many deformations such as compression, bending and torsion into electrical signals. Compared with piezoelectric and capacitive strain sensors, piezoresistive sensors are easier to test and have less interference ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/22G01L9/04
CPCG01L1/22G01L9/04
Inventor 卢红亮刘梦洋张卫
Owner FUDAN UNIV
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