Manufacturing method of packaging substrate

Abstract

The invention relates to a manufacturing method of a packaging substrate and belongs to the technical field of a circuit board. The method comprises steps of forming an insulating resin reinforced metal layer on one surface of a metal layer through methods of printing and the like; coating a photoresist layer on the metal layer, and then carrying out a series of processing such as exposure, development, etching, film stripping and the like to remove the redundant metal layer so as to form a required circuit; and then, forming a solder resist layer at other positions of the circuit except a device region and a connection region. Compared with manufacturing of a conventional packaging substrate, the manufacturing method is advantaged in that the used base material is changed and replaced byinsulating resin, so the thickness of the base material is reduced, width of the metal layer is reduced, a metal frame of a product is reduced, and the requirement of lightening and thinning the circuit board is met; the insulating resin is directly arranged on the metal layer and then is processed to form the circuit, the thin metal layer is utilized, the thin metal layer is more beneficial to formation of the circuit, the circuit with smaller line width and line distance is processed, so refinement of the circuit can be realized.

Description

technical field [0001] The invention relates to a method for manufacturing a packaging substrate, which belongs to the technical field of circuit boards. Background technique [0002] With the rapid development of the electronics industry in recent years, electronic equipment has become shorter, smaller, lighter, and thinner. Correspondingly, circuit boards are also required to be lighter and thinner, and circuits are also required to be more refined. In the production and manufacture of COF, a substrate composed of a metal layer and an insulating film layer is usually used, and the metal layer of the substrate is processed by coating photoresist, exposure, development, etching, etc. to form the required circuit, and then in the Solder resist layers are formed on the required parts of the circuit by printing or other methods to protect and strengthen the circuit. The thickness of the metal layer of the substrate is usually 8~20µm, the thickness of the insulating film layer ...

AI Technical Summary

Problems solved by technology

The thickness of the metal layer of the substrate is usually 8~20µm, the thickness of the insulating film layer is usually 35µm, the overall thickness of the substrate is about 45µm, and the width is usually 158mm; the thickness of the protective layer on the later circuit is usually 10µm, so the thickness of the final product is about The thickness is 55µm, which cannot meet the needs of thinner and smaller circuit boards

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