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System-in-package structure and electronic device

A system-level packaging, electronic equipment technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of inconvenient manufacturing and complex structure, and achieve the effect of shortening the line length, simple connection, and simplified structure

Inactive Publication Date: 2020-01-03
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Apparently, such a method has the defects of complicated structure and inconvenient manufacture.

Method used

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  • System-in-package structure and electronic device
  • System-in-package structure and electronic device
  • System-in-package structure and electronic device

Examples

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Embodiment Construction

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0039] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0040] In addition, in t...

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Abstract

The invention discloses a system-in-package structure and an electronic device using the same. The system-in-package structure comprises: a substrate which is provided with an installation surface; alight source arranged on the installation surface and electrically connected with the substrate; a photoelectric conversion device arranged on the installation surface, electrically connected with thesubstrate and spaced from the light source; and an analog front end arranged on the substrate and electrically connected with the substrate. According to the technical scheme, the structure of the electronic equipment can be simplified, and the manufacturing convenience is improved.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a system-in-package structure and electronic equipment using the system-in-package structure. Background technique [0002] Existing electronic devices (such as mobile phones, notebook computers, tablet computers, and wearable devices) are generally equipped with various optical devices (such as light-emitting diodes, photodiodes, etc.) to realize corresponding functions. However, in the vast majority of electronic devices at present, the optical devices are installed separately and wired separately to achieve position fixation and circuit conduction. Apparently, such a method has the defects of complicated structure and inconvenient manufacture. [0003] The above content is only used to assist in understanding the technical solution of the present invention, and does not mean that the above content is admitted as prior art. Contents of the invention [0004] Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/31
CPCH01L23/3107H01L25/167
Inventor 王文涛方华斌王德信
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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