An experimental device for heat dissipation of electronic chips based on thin film evaporation

Abstract

The invention discloses an electronic chip heat dissipation experiment device based on film evaporation. A cooling working medium is stored in a liquid storage tank, enters a liquid inlet of a film evaporation generator through a piezoelectric micro pump, and reaches a film evaporation chip through a liquid supply channel. The redundant cooling working medium at the film evaporation chip reaches aliquid outlet through a liquid discharge channel of the film evaporation generator, leaves the film evaporation generator and finally reaches the liquid storage tank through a pipeline. Gas directlygenerated by film evaporation at the film evaporation chip reaches a heat exchanger of a temperature control device through a gas outlet, is condensed into liquid, and finally reaches the liquid storage tank. The redundant liquid working medium and the generated gas working medium in the film evaporation generator finally return to the liquid storage tank in a liquid state to finish a cycle. The electronic chip heat dissipation experiment device has the advantages of small occupied area, low power consumption and high heat dissipation capacity, and can meet the heat dissipation requirement that the heat flow density exceeds 1kW / cm<2>.

Description

technical field [0001] The invention relates to the technical field of electronic chip cooling enhanced heat transfer, in particular to an electronic chip heat dissipation experimental device based on thin film evaporation. Background technique [0002] With the rapid growth of the world's industrial development, the demand for high-efficiency heat exchange devices with higher power density continues to increase. At the same time, the size of electronic products is getting smaller and smaller, which poses a huge challenge to heat dissipation. Boiling heat transfer, which utilizes a large amount of latent heat in the phase transition process, is a way to solve the heat dissipation of electronic devices under high heat flow, but it is difficult to avoid the mutual restriction of gas-liquid two-phase in boiling heat transfer, and it is impossible to realize the separation of gas escape channel and liquid supply channel. Therefore, it is difficult to further realize the heat di...

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Problems solved by technology

At the same time, the volume of electronic products is getting smaller and smaller, which brings great challenges to heat dissipation

Boiling heat transfer, which utilizes a large amount of latent heat in the phase transition process, is a way to solve the heat dissipation of electronic devices under high heat flow, but it is difficult to avoid the mutual limitation of gas and liquid phases in boiling heat transfer, and it is impossible to separate the gas from the channel and the liquid supply channel. , so it is difficult to further realize the heat dissipation of ultra-high heat flux

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