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Rapid measurement device for deformation of diamond rope saw

A technology of diamond wire saw and measuring device, which is applied in the field of optical measurement and can solve problems such as overcutting, inability to measure directly, and scrapping of workpieces.

Inactive Publication Date: 2020-01-07
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the beaded rope is semi-flexible, it will generate free vibration during processing. The lateral vibration and axial vibration of the diamond wire saw will cause the beaded rope to deviate from the originally designed sawing track, resulting in overcutting and undercutting. lead to workpiece scrapping
Since the matrix of the diamond wire saw enters the workpiece during the sawing process, conventional methods cannot directly measure
The traditional measurement method is to analyze the force of the guide wheels at both ends of the diamond wire saw, and qualitatively analyze the deformation of the diamond wire saw. This is only a reference, and cannot solve the problem of workpiece scrapping caused by over-cutting and under-cutting.

Method used

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  • Rapid measurement device for deformation of diamond rope saw
  • Rapid measurement device for deformation of diamond rope saw
  • Rapid measurement device for deformation of diamond rope saw

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Experimental program
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Embodiment Construction

[0018] specific implementation plan

[0019] In order to further understand the content, features and effects of the present invention, the following examples are given, and detailed descriptions are given below with reference to the accompanying drawings.

[0020] A device for quickly measuring deformation of a diamond wire saw, comprising a one-dimensional guide rail 5, a laser monocular vision sensor 1, an image acquisition card, a driving device 4, and a cloud platform 2;

[0021] Such as figure 1 As shown, the laser monocular sensor 1 mainly includes two parts of a laser emitter 1-3 and a CCD camera 1-4, wherein the laser sensor 1-3 is perpendicular to the surface 1-2 of the measured object to ensure that the laser light path is perpendicular to the object being measured. The surface of the measured object 1-2; the CCD camera 1-4 is placed at a certain inclined angle to receive the laser light reflected by the surface of the measured object.

[0022] Such as figure 2 ...

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PUM

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Abstract

The invention provides a rapid measurement device for deformation of a diamond rope saw. A support is arranged on a one-dimensional guide rail, a laser monocular vision sensor is placed on the support, moving in an x direction can be performed by a driving system on the one-dimensional guide rail, the laser monocular vision sensor comprises a linear scanning laser emitter and a CCD sensor, the linear scanning laser emitter is used for emitting linear laser, the linear laser is projected to the diamond rope saw, the CCD sensor is used for capturing light knife on the diamond rope saw, a light knife image is processed by a light knife point cloud extraction algorithm, assembly characteristic image point cloud data is extracted to obtain an image coordinate system at the rope saw, and visualsystem is used for calibrating to finally obtain a world coordinate system. By moving of the driving system on the one-dimensional guide rail in the x direction, equal-distance sampling is performed,the world coordinate system of the rope saw at a scanning region is acquired and is converted to three-dimensional information, and the deformation information of the diamond rope saw can be rapidlyobtained.

Description

technical field [0001] The invention relates to the technical field of optical measurement, in particular to a detection method for measuring the deformation of a diamond wire saw when sawing a workpiece. Background technique [0002] When the diamond wire saw is sawing the workpiece, the diamond wire saw is in a balanced position at the beginning, and the diamond wire saw is in a straight line. As the processing progresses, the diamond wire saw comes into contact with the workpiece, changing from point contact to surface contact. The force on the base of the wire saw begins to be uneven, resulting in a wire bow angle. Since the beaded rope is semi-flexible, it will generate free vibration during processing. The lateral vibration and axial vibration of the diamond wire saw will cause the beaded rope to deviate from the originally designed sawing track, resulting in overcutting and undercutting. cause the workpiece to be scrapped. Since the substrate of the diamond wire saw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/16
CPCG01B11/16
Inventor 尹方辰余刘齐崔长彩宋宁宁
Owner HUAQIAO UNIVERSITY