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Silicon nitride ceramic circuit board structure

A technology of silicon nitride ceramics and circuit boards, which is applied in the direction of circuit substrate materials, printed circuits, printed circuit manufacturing, etc., and can solve problems such as weaker bonding than AMB, high temperature, and dangerous operators

Inactive Publication Date: 2020-01-07
德胜光电股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0018] As can be seen from the above steps, the temperature involved in this method is as high as more than 1,000 degrees, so that the working environment is quite dangerous for the operator. At the same time, because the bonding strength is not as strong as AMB, Many people would rather choose the more expensive but more stable AMB

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  • Silicon nitride ceramic circuit board structure
  • Silicon nitride ceramic circuit board structure
  • Silicon nitride ceramic circuit board structure

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specific Embodiment

[0055] Although the specific embodiments of the present invention have been listed in detail by the above description, the steps of the present invention can be refined again in order to achieve structural conformity; the following will describe the manufacturing process of the present invention again.

[0056] Please see Figure 6 As shown, it can be seen that the first step of another embodiment of the present invention is to provide a ceramic substrate 10; the ceramic substrate can be aluminum nitride (AlN), aluminum oxide (Al2O3), silicon nitride (Si3N4). Since the ceramic substrate is basically an insulator, when it is desired to make a circuit board, some surface treatment must be done on the ceramic substrate of this insulator; therefore, in the manufacturing steps of the present invention, the The surface of the above-mentioned ceramic substrate 10 is coated with a non-compound, non-alloy single metal layer 20 by sputtering.

[0057] The non-compound single metal laye...

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Abstract

The invention mainly relates to a silicon nitride ceramic circuit board structure. The preparation method mainly comprises steps that firstly, a ceramic substrate which can be aluminum oxide (Al2O3),silicon nitride (Si3N4) or aluminum nitride (AlN), preferably silicon nitride is provided; then, a titanium metal layer is plated on each of two sides of the ceramic substrate at the same time, and acopper layer is plated on each titanium metal layer; after the copper layer is plated, a layer of thick copper plate is directly pressed and fixed on the copper layer at the high temperature of 350-500 DEG C under the pressure of 4+ / -1Kg / mm<2>; after the thick copper plate is combined with the copper layer, a required pattern is etched in a yellow light development mode to finish manufacturing ofthe ceramic circuit board.

Description

technical field [0001] The present invention mainly relates to a novel ceramic circuit board, especially a structure of a silicon nitride ceramic circuit board. Background technique [0002] Also known as printed circuit board, printed circuit board, often use the English abbreviation PCB (Printed circuit board) or write PWB (Printed wire board), is an important electronic component, according to the circuit design, the electrical wiring connecting the circuit parts is drawn into a graph , and then use the mechanical processing and surface treatment specified by the design to reproduce the electrical conductor on the insulator to form a circuit board; in other words, the printed circuit board is the substrate before matching electronic parts. The function of this type of product is to use the electronic circuit formed by various electronic parts and circuit boards to play the functions of various electronic components to achieve the purpose of signal processing; it is the su...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K1/03
CPCH05K1/0306H05K3/022
Inventor 张胜翔廖建勋施彩云吴书豪
Owner 德胜光电股份有限公司