Fine-pitch BGA novel packaging structure and filter capacitor design method
A technology of filter capacitors and packaging structures, applied in circuits, electrical components, electrical solid devices, etc., to achieve the effect of improving integrity and reducing impedance characteristics
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[0029] The technical solution of the present invention will be further described and illustrated through specific embodiments below, so that the technical solution will be clearer and clearer. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0030] This embodiment relates to a novel packaging structure and filter capacitor design method of fine-pitch BGA, such as figure 1 As shown, the method includes the following steps:
[0031] (1) Design and install filter capacitors on the front of the BGA package substrate;
[0032] (2), design BGA package pin assignment;
[0033] (...
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