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A method of manufacturing composite microspheres and core-shell composite microspheres for EMI shielding

A composite microsphere, core-shell type technology, applied in the field of composite materials, can solve the problems of complex manufacturing process and operation mode, not suitable for mass production, poor electromagnetic shielding effect, etc.

Active Publication Date: 2020-10-27
HANGZHOU JWL TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the problems that the anti-EMI material in the above EMI shielding technology has complicated manufacturing process and operation mode, is not suitable for mass production, and has poor electromagnetic shielding effect, the present invention proposes a method for manufacturing composite microspheres and a core-shell type Composite microspheres to solve the above problems

Method used

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  • A method of manufacturing composite microspheres and core-shell composite microspheres for EMI shielding
  • A method of manufacturing composite microspheres and core-shell composite microspheres for EMI shielding
  • A method of manufacturing composite microspheres and core-shell composite microspheres for EMI shielding

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Embodiment 1

[0042] Figure 5 A process flow for manufacturing composite microspheres of an embodiment of the application is shown, comprising the following steps:

[0043] S1: put metal particles into deionized water for ultrasonic dispersion;

[0044] S2: put into the mixed solution containing the silane coupling agent for the first stirring;

[0045] S3: After adding ammonia water and a mixed solution containing TEOS, conduct a closed reaction, wherein the mixed solution containing TEOS is added several times;

[0046] S4: performing solid-liquid separation on the solution obtained after the reaction in step S3 to obtain a final product.

[0047] In a specific embodiment, the metal particles are submicron metal particles made of Ag, Au, Cu, NiFe, Ni or Cr materials. Submicron metal particles are small in size and easy to be dispersed evenly. In a preferred embodiment, the diameter of the metal particles is between 0.1 um and 30 um. The metal particles can be selected with the same ...

Embodiment 2

[0051] The specific process flow is the same as in Example 1. The time for the first stirring is set to 0.2h, 0.5h, 1h and 1.5h respectively, the reaction temperature of the closed reaction is 30°C, and the reaction time is 4h. After the ammonia water is reacted in step S3 The volume ratio of the obtained solution is 1%, the volume ratio of TEOS and ethanol is 1:9, the volume ratio of KH-550 and TEOS is 1:5, and the volume ratio of TEOS and ethanol added for the first time is 1:15, The volume ratio of TEOS and ethanol added for the second time is 1:9. The experimental data in Table 1 below were obtained.

[0052] Table 1 The time of stirring for the first time on the coating effect of composite microspheres and SiO 2 Effect of thickness

[0053]

[0054] It can be seen from the above table that the composite microsphere prepared by setting the time of the first stirring between 0.5h and 1h has good coating effect and high efficiency, and the SiO 2 The thickness of the la...

Embodiment 3

[0056] The specific process flow is the same as that in Example 1. The time for the first stirring is 1h, the reaction temperature of the closed reaction is set to 20°C, 30°C, 40°C, 50°C, 60°C, and 70°C respectively, and the reaction time is 4h. The volume ratio of ammonia water in the solution obtained after the reaction in step S3 is 1%, the volume ratio of KH-550 and TEOS is 1:5, the mixed solution containing TEOS is added twice, and the volume ratio of TEOS and ethanol added for the first time is The volume ratio of TEOS and ethanol added for the second time was 1:15. get as Figure 8 The reaction temperature shown with SiO 2 Variation curve of particle size.

[0057] Depend on Figure 8 It can be seen that the optimal reaction temperature of the closed reaction is 20-40°C, at this time SiO 2 Small particle size, uniform and dense SiO can be formed on the surface of metal particles 2 Floor. If the reaction temperature is too low, the hydrolysis reaction will be incom...

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Abstract

The embodiment of the invention discloses a method for manufacturing composite microspheres and core-shell type composite microspheres for EMI shielding. The method comprises the steps: putting metalparticles into deionized water for ultrasonic dispersion; adding a mixed solution containing a silane coupling agent, and stirring for the first time; then adding ammonia water and a mixed solution containing TEOS, and then carrying out sealed reaction, wherein the mixed solution containing TEOS is added in multiple times; and finally, carrying out solid-liquid separation on a solution obtained after the reaction to obtain a final product. The final product is small in granularity, reasonable in grain composition, good in dispersity and good in corrosion resistance; a good anti-EMI effect is achieved; the final product can be used for filling in a small-size radio frequency communication module product, each module in the small-size radio frequency communication module product is preventedfrom being interfered by an EM source without changing the size and the internal structure of the product, having any additional device and causing short circuit of the internal modules, the processis simple, and is suitable for large scale product, and shielding effect lasts long and is reliable.

Description

technical field [0001] The application relates to the field of composite materials, and mainly relates to a method for manufacturing composite microspheres and core-shell composite microspheres for EMI shielding. Background technique [0002] With the rapid development of communication technology, electromagnetic wave pollution is becoming more and more serious, which seriously interferes with the normal operation of equipment. When RF module products work, in addition to external electromagnetic interference, they also interfere with each other due to the similar frequency bands of some internal modules, and the internal space is small and the modules are highly concentrated. In order to ensure the normal and effective operation of RF products, it is necessary to shield the interference of external EM (electromagnetic) sources and other internal module EM sources, especially the shielding of low-frequency electromagnetic interference. [0003] There are four types of anti-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J13/22B01J13/20
CPCB01J13/206B01J13/22
Inventor 张伟军盛荆浩江舟
Owner HANGZHOU JWL TECH INC