Copper-containing printed circuit board wastewater treatment method

A copper printed circuit board and waste water treatment technology, applied in water/sewage treatment, neutralized water/sewage treatment, water/sewage multi-stage treatment, etc., can solve the problems of poor sedimentation effect and high cost, and achieve small sludge production , low cost, and the effect of preventing the blackening of the effluent water quality

Inactive Publication Date: 2020-01-14
JINDUICHENG MOLYBDENUM CO LTD
View PDF3 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a copper-containing printed circuit board wastewater treatment method, which solves the problems of high cost and poor precipitation effect in the existing wastewater treatment method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper-containing printed circuit board wastewater treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] A method for treating copper-containing printed circuit board wastewater, specifically: pumping copper-containing printed circuit board wastewater into a reaction kettle, the wastewater contains [Cu(NH 3 ) 4 ] 2+ complex, use sulfuric acid to adjust the pH value of the wastewater to 2.5, start stirring, and control the stirring temperature to 40°C; add complex-breaking agent ferrous sulfate particles in the reaction kettle, ferrous sulfate particles and containing [Cu(NH 3 ) 4 ] 2+ The complex compound carried out the complex reaction, stirred for 30 minutes; in the reactor, adding mass percent concentration was 30% hydrogen peroxide (H 2 o 2 ) as an oxidant, the oxidant and [Cu(NH 3 ) 4 ] 2+ Complex compound carries out intensified reaction, stirs 30 minutes; Adjust the pH value of waste water to be 7.0, add sodium sulfide as precipitating agent, precipitating agent and [Cu(NH 3 ) 4 ] 2+ The complex was precipitated and stirred for 20 minutes; the pH value of...

Embodiment 2

[0054] A method for treating copper-containing printed circuit board wastewater, specifically: pumping copper-containing printed circuit board wastewater into a reaction kettle, the wastewater contains copper chloride complex [Cu(Cl - ) 4 ] 2 , adjust the pH value of the waste water to 2.8, start stirring, and control the stirring temperature to 45°C; add complex-breaking agent ferrous sulfate particles in the reaction kettle, ferrous sulfate particles and copper chloride complex [Cu(Cl - ) 4 ] 2 Carry out decomplexation reaction, stir 35 minutes; In reaction kettle, add mass percent concentration and be 30% hydrogen peroxide (H 2 o 2 ) as an oxidizing agent, the oxidizing agent and the copper chloride complex [Cu(Cl - ) 4 ] 2- Carry out intensified reaction, stir 35 minutes; Regulate the pH value of waste water to be 7.5, add sodium sulfide as precipitation agent, precipitation agent and copper chloride complex [Cu(Cl - ) 4 ] 2- Carry out precipitation reaction, sti...

Embodiment 3

[0056] A method for treating copper-containing printed circuit board wastewater, specifically: pumping copper-containing printed circuit board wastewater into a reaction kettle, the wastewater containing copper EDTA complex [Cu(EDTA)] 2+ , adjust the pH value of the wastewater to 3.0, start stirring, and control the stirring temperature to be 50°C; add complexing agent ferrous sulfate particles in the reaction kettle, ferrous sulfate particles and [Cu(EDTA)] 2+ Carry out decomplexion reaction, stir 40 minutes; Add mass percent concentration in reactor and be the hydrogen peroxide (H2O2) of 30%. 2 o 2 ) as an oxidizing agent, the EDTA complex of the oxidizing agent and copper [Cu(EDTA)] 2+ Carry out intensified reaction, stir for 40 minutes; Adjust the pH of waste water to be 8.0, add sodium sulfide as precipitant, precipitant and [Cu(EDTA)] 2+ Carry out precipitation reaction, stir for 30 minutes; adjust the pH value of the wastewater to 8.0, add polyacrylamide solution with...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a copper-containing printed circuit board wastewater treatment method which specifically comprises the following steps: step 1, pumping copper-containing printed circuit boardwastewater, which contains copper complex, into a reaction kettle by using a pump, and adjusting the pH value of the wastewater, step 2, adding a complex breaking agent into the reaction kettle, carrying out complex breaking reaction on the complex breaking agent and the wastewater copper complex, and stirring for 30-40 minutes; step 3, adding an oxidizing agent into the reaction kettle, carryingout enhanced reaction on the oxidizing agent and the wastewater copper complex, and stirring for 30-40 minutes; 4, adjusting the pH value of the wastewater, adding a precipitant, carrying out precipitation reaction on the precipitant and the wastewater copper complex, and stirring for 20-30 minutes; and step 5, regulating the pH value of the wastewater, adding a flocculating agent, stirring for 5-10 minutes, precipitating and standing for 2-3 hours. The invention solves the problems of high cost and poor precipitation effect in the existing wastewater treatment method.

Description

technical field [0001] The invention belongs to the technical field of wastewater treatment, and relates to a method for treating copper-containing printed circuit board wastewater. Background technique [0002] In the rapid development of the semiconductor electronic information industry, the wastewater produced by electroless copper plating of circuit boards contains a large amount of copper, which damages the ecological environment and threatens human health. The heavy metal copper ions in the wastewater form relatively stable complexes. The conventional precipitation and coagulation treatment methods are difficult to precipitate the copper ions of the complex structure. It is difficult to reach the standard for COD and copper, especially for copper ions. The complexation reaction dissociates copper ions from the complex structure, and then precipitates and coagulates. Generally, ferrous sulfate or sodium sulfide method is used to break the network. The advantage of ferr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/04C02F11/122C02F101/20
CPCC02F1/5236C02F1/56C02F1/62C02F1/66C02F1/722C02F9/00C02F11/122C02F2101/20
Inventor 唐军利崔玉青段琳琳席莎
Owner JINDUICHENG MOLYBDENUM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap