A kind of sapphire wafer cutting equipment and process

Abstract

The invention discloses a sapphire wafer cutting equipment and process, comprising a first support plate, a second support plate, a bottom plate, a U-shaped support plate, a side slide plate, a strip groove, a long cylinder, a first cylinder, a strip cutter, Second cylinder, L-shaped plate, ring frame, bearing, ring gear, short cylinder, screw, servo motor, drive gear, balls, first suction cup, third cylinder, threaded long rod, second suction cup, threaded deep hole and Circular plate. The present invention is convenient to fix the two ends of the sapphire ingot to be cut through two corresponding suction cups and the connecting structure, and at the same time, it can be cut step by step under the push of the third cylinder and the assistance of the ball on the push rod of the first cylinder. The effect of material supply at the structure, by starting the second cylinder to push the connected strip cutter to cut the same part of the sapphire ingot in stages, can avoid the situation of knife jamming, ensure the same cutting amount each time, and avoid cutting out The problem of falling sapphire wafers can be solved, and the yield rate can be improved.

Description

technical field [0001] The invention relates to cutting equipment and a process, in particular to a sapphire wafer cutting equipment and a process, belonging to the technical field of sapphire wafer cutting applications. Background technique [0002] Chip is one of the most important raw materials of LED. It is the light-emitting part of LED and the core part of LED. The quality of the chip will directly determine the performance of the LED. The chip is composed of group III and V compound semiconductor materials. When packaging, the chip incoming material is neatly arranged on the chip film, such as a sapphire chip. [0003] During the process of slitting the sapphire crystal rod into multiple sapphire wafers, due to the improper operation of the cutting blade, the knife may be jammed. After each slitting, the feeding speed is slow and discontinuous or some cutting equipment lacks feeding Due to the structure, there is a hidden danger of accidental drop and damage when the...

AI Technical Summary

Problems solved by technology

[0003] In the process of cutting the sapphire ingot into multiple sapphire wafers, the cutting blade may get stuck due to improper operation of the cutting blade. After each cutting, the feeding speed is slow and discontinuous or part of the cutting equipment lacks feeding The structure, split into pairs of sapphire wafers, there is a hidden danger of accidental drop and damage at the moment of separation

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