A back-illuminated avalanche gain EMCCD refrigeration package structure and method
A packaging structure, back-illuminated technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of large volume, low reliability, and no consideration of long-term reliability and mutual influence, and achieve Improve design accuracy, avoid electrical interference, and reduce the number of effects
Active Publication Date: 2022-02-22
THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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Problems solved by technology
With the increasing reliability requirements of back-illuminated avalanche-gain EMCCDs and the miniaturization of physical dimensions in practical applications, existing design methods do not take into account long-term reliability operation, coupling with heat sinks, and interactions between packages. Influence, especially the airtightness between the light window and the package housing, therefore, existing design methods have disadvantages such as low reliability and large volume
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[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0037] Such as Figure 1-4 As shown, a back-illuminated avalanche gain type EMCCD cooling packaging structure includes: a cavity 18, a semiconductor refrigerator 12, a ceramic ring frame 10, a back-illuminated avalanche gain type EMCCD and an optical window 2, and the cavity 18 is Rectangular frame structure, four mounting holes 16 are arranged around the outer bottom of the cavity; a semiconductor refrigerator 12 is installed inside the cavity, and the hot en...
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The invention discloses a back-illuminated avalanche gain type EMCCD refrigeration packaging structure and method, comprising: a cavity, a semiconductor refrigerator, a ceramic ring frame, a back-illuminated avalanche gain type EMCCD and an optical window, and the cavity is a rectangular frame Structure: A semiconductor refrigerator is installed inside the cavity, the hot end of the semiconductor refrigerator is provided with pre-solder, the semiconductor refrigerator and the cavity are welded by reflow soldering, and the semiconductor refrigerator is electrically connected to the cavity by means of electrical equipment ; The cold end of the semiconductor refrigerator is connected to the back-illuminated avalanche gain type EMCCD through a high thermal conductivity material; the cavity is connected to the ceramic ring frame, and the ceramic ring frame and the optical window are sealed and connected by high-reliability epoxy resin. The EMCCD refrigeration packaging structure of the present invention considers the mutual influence of the refrigeration device, the image sensor and the packaging at the same time, improves the design precision, and achieves refrigeration, heat dissipation, airtightness and reliability design.
Description
technical field [0001] The invention relates to the technical field of image sensor package design, in particular to a back-illuminated avalanche gain type EMCCD refrigeration package structure and method. Background technique [0002] Electron Multiplication Charge Coupled Device (EMCCD) has the characteristics of high sensitivity and high frame rate, and is widely used in astronomical observation, biomedicine, scientific research, industrial production and other fields. Among the important factors affecting the detection performance of EMCCD, the temperature has a significant impact on the electron multiplication gain. The lower the temperature, the smaller the dark current noise, the more secondary electrons are generated, and the greater the electron multiplication gain. [0003] Most of the existing refrigeration packaging technology chambers are filled with inert gas, but the cooling effect is far inferior to the packaging technology with a permanent vacuum inside the ...
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IPC IPC(8): H01L23/495H01L23/367H01L23/38
CPCH01L23/49568H01L23/3672H01L23/38H01L23/3677
Inventor 程顺昌林珑君
Owner THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP