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A Stress Relief Structure for Improving the Reliability of Hermetic Welding of Multi-core Connectors

A technology for stress relief and connectors, which is applied to parts, connections, and electrical components of connecting devices, can solve problems such as complex features, cracking and air leakage of connectors, and small sintered surfaces, so as to reduce packaging weight, change rigidity, The effect of reducing product cost

Active Publication Date: 2021-10-22
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sintered surface between the Kovar shell and the glass body of the connector is small and has complex features, and it is easy to form concentrated stress exceeding the strength of the glass sintered surface, resulting in cracking and air leakage of the connector.

Method used

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  • A Stress Relief Structure for Improving the Reliability of Hermetic Welding of Multi-core Connectors
  • A Stress Relief Structure for Improving the Reliability of Hermetic Welding of Multi-core Connectors
  • A Stress Relief Structure for Improving the Reliability of Hermetic Welding of Multi-core Connectors

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings.

[0029] The stress relief structure for improving the reliability of airtight welding of multi-core connectors in the present invention includes an elastic transition zone, and the elastic transition zone is arranged between the multi-core connector and the main structure of the cavity. When airtight welding is realized, the The elastic transition zone can effectively reduce the stress concentration of joints caused by temperature changes. The elastic transition zone can be a component provided separately, or it can be provided on the cavity body and integrally formed with the cavity body. The size of the stress relief structure can be flexibly adjusted according to the thickness of the cavity and the actual processing capacity.

[0030] Preferably, a concave portion is provided on one side surface of the elastic transition zone, and the one side surface refers to the ...

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Abstract

The invention relates to the technical field of microelectronic airtight packaging, and discloses a stress release structure for improving the reliability of airtight welding of multi-core connectors. The stress release structure is an elastic transition area, which is arranged between the multi-core connector and the main structure of the cavity, and is used for releasing stress when airtight welding is realized. The elastic transition area is provided with a concave part, and the shape of the concave part may be an annular groove or continuously distributed elongated holes or continuously distributed circular holes. The above scheme changes the stiffness of the welding part of the cavity joint, which can greatly reduce the risk of connector cracking and air leakage caused by thermal expansion mismatch when the multi-core connector is welded to the aluminum alloy cavity and during subsequent use, and solves the problem of multi-core connectors. The thermal mismatch problem of airtight welding with the cavity improves the welding yield and reliability of the product.

Description

technical field [0001] The invention relates to the technical field of microelectronic hermetic packaging, in particular to a stress relief structure for improving the reliability of airtight welding of multi-core connectors. Background technique [0002] In the field of microelectronic packaging, as the overall space resources are approaching saturation, the metal hermetic packaging of various products tends to be miniaturized and lightweight. At the same time, there are more and more product input and output interfaces. [0003] Traditional hybrid integrated hermetic packaging mostly adopts a layered structure, such as figure 1 As shown, the metal cavity is divided into positive and negative sides. The bare die is arranged on the front side and hermetically sealed to form a front airtight cavity. A standard connector (such as a D-type connector) fixed on the side wall is used as an interactive interface for external signals. However, traditional standard connectors most...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/502H01R13/504H01R13/52
CPCH01R13/5025H01R13/504H01R13/52
Inventor 景飞张童童廖翱高阳卢茜何彬
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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